Q MOBILE M88 RECOVERED WITH CM2 READED PAC FILE

ilyasrao

Active Member
Nov 15, 2016
29
14
pakpattan pakistan
UPLOAD SP7731CEA_i8i_7.0_QMobile_i8i_MP_30_09_QMobile_i8i.pac FILE TO UpgradeDownload TOOL IT EXTRACTED PAC FILE AND I GET INIFINITY_SC77XX.XML FILE IN UPGRADE DOWNLOAD FOLDER
LOAD INIFINITY_SC77XX.XML FILE ON FATORY IMAGE TABE BMAconfig AND SELECT WRITE
NOTE: DONT CLOSE UPGRADEDOWNLOAD TOOL BEFORE FULL WRITEN
YOU CAN VISIT VIDEO FROM HERE

Init bus...
VCC: 3.3 V, VCCQ: 3.0 V
Bus: 8 bit (HS SDR 52MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x90 (SK Hynix)
Product name: H8G1e (0x483847316505), rev: 0x07, serial number: 0x39A1B8A9
Manufacturing date: Aug 2015
CID: 90014A48 38473165 050739A1 B8A982F6
CSD: D0270132 0F5903FF FFFFFFEF 8A4040D2
EXT_CSD revision: 1.7 (MMC v5.0, v5.01)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 7.28 GiB(7,818,182,656 bytes)

Current partition access:
Access to boot partition 1
Erasing boot1 data... Done in 0.297 s
Current partition access:
Access to boot partition 2
Erasing boot2 data... Done in 0.404 s
Current partition access:
Access to user area
Erasing userarea data... Done in 1.655 s

Init bus...
VCC: 3.3 V, VCCQ: 3.0 V
Bus: 8 bit (HS SDR 24MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x90 (SK Hynix)
Product name: H8G1e (0x483847316505), rev: 0x07, serial number: 0x39A1B8A9
Manufacturing date: Aug 2015
CID: 90014A48 38473165 050739A1 B8A982F6
CSD: D0270132 0F5903FF FFFFFFEF 8A4040D2
EXT_CSD revision: 1.7 (MMC v5.0, v5.01)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 7.28 GiB(7,818,182,656 bytes)

Re-partitioning... Done.
Writing MBR, GPT at 0x00000000-0x000043FF (34 sectors)... Done in 0.004 s
Current partition access:
Access to boot partition 1
Processing file: "u-boot-spl-16k.bin"...
Writing splloader at 0x00000000 (64 sectors)... Done in 0.018 s
Current partition access:
Access to boot partition 2
Processing file: "u-boot.bin"...
Writing uboot at 0x00000000 (1056 sectors)... Done in 0.184 s
Current partition access:
Access to user area
Processing file: "prodnv.img"...
Writing prodnv at 0x00100000 (10240 sectors)... Done in 0.648 s
Processing file: "logo_480x854.bin"...
Writing logo at 0x02100000 (802 sectors)... Done in 0.053 s
Processing file: "logo_480x854.bin"...
Writing fbootlogo at 0x02200000 (802 sectors)... Done in 0.049 s
Processing file: "boot.img"...
Writing boot at 0x02300000 (25808 sectors)... Done in 1.662 s
Processing file: "system.img"...
Writing system at 0x03200000 (5120000 sectors)... Done in 5 mins 24.781 s
Processing file: "sysinfo.img"...
Writing sysinfo at 0x9FA00000 (8768 sectors)... Done in 0.563 s
Processing file: "cache.img"...
Writing sparse image cache at 0xA0000000 (307200 sectors)... Done in 1.037 s
Processing file: "recovery.img"...
Writing recovery at 0xA9600000 (28488 sectors)... Done in 1.754 s
Processing file: "userdata.img"...
Writing sparse image userdata at 0xAA900000 (-2048 sectors)... Done in 14.572 s
Writing boot partition config to 0x08... Done.

Init bus...
VCC: 3.3 V, VCCQ: 3.0 V
Bus: 8 bit (HS SDR 52MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x90 (SK Hynix)
Product name: H8G1e (0x483847316505), rev: 0x07, serial number: 0x39A1B8A9
Manufacturing date: Aug 2015
CID: 90014A48 38473165 050739A1 B8A982F6
CSD: D0270132 0F5903FF FFFFFFEF 8A4040D2
EXT_CSD revision: 1.7 (MMC v5.0, v5.01)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 7.28 GiB(7,818,182,656 bytes)

Current partition access:
Access to boot partition 1
Blank checking boot1 (8192 sectors)... non-blank at 0x00000000: data [ fe 00 00 ea ]
Current partition access:
Access to boot partition 2
Blank checking boot2 (8192 sectors)... non-blank at 0x00000000: data [ 13 00 00 ea ]
Current partition access:
Access to user area
Blank checking userarea (15269888 sectors)... non-blank at 0x000001C0: data [ 00 00 ee 00 ]

Init bus...
VCC: 3.3 V, VCCQ: 3.0 V
Bus: 8 bit (HS SDR 52MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x90 (SK Hynix)
Product name: H8G1e (0x483847316505), rev: 0x07, serial number: 0x39A1B8A9
Manufacturing date: Aug 2015
CID: 90014A48 38473165 050739A1 B8A982F6
CSD: D0270132 0F5903FF FFFFFFEF 8A4040D2
EXT_CSD revision: 1.7 (MMC v5.0, v5.01)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 7.28 GiB(7,818,182,656 bytes)
Cache size: 1 MiB
Hardware reset function: 1
Partition configuration: 0x08
No boot acknowledge is sent (default)
Boot partition 1 is enabled for boot
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x00
Boot area write protection: 0x00
Power-on write protection: possible
Permanent write protection: possible
Lock status: not locked

ANDROID System Info:
platform: sc8830, cpu abi: armeabi-v7a
manufacturer: Qmobile
board: sp7731cea, name: i8i
brand: Qmobile, model: QMobile i8i
build id: NRD90M, version: 4.4.2 Lollipop (QMobile_i8i_MP_30_09)
build description: i8i-user 7.0 NRD90M 135 release-keys

Internal storage: 4.62 GiB
crypto state: unencrypted
Selected: [HYNIX] eNAND H9TQ64ABJTMCUR-KUM/8GB+LPDDR3 16Gb (BGA221)

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Reactions: Admin