Post Sucessfully Here Sucessfully Repaired/Dead Recovered Handset By Ufi Box

ferouzkassim

Member
Oct 11, 2018
7
8
Skype
ferouz_kassim
SM-G531H SUCCESFULLY REPAIRED EFS AND OTHER FILES BY UFI
Connection status: XHCI:HUB3:USB 2.0 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8840-4224
Boot version: 1.04, FW version: 1.12 (Jun 7 2018 00:06:47)
Insertion test... Done.
Init bus...
VCC: 2.8 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 4MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0xFE (Micron)
Product name: P1J95K (0x50314a39354b), rev: 0x13, serial number: 0x7271E1AB
Manufacturing date: Jul 2015
CID: FE014E50 314A3935 4B137271 E1AB7240
CSD: D07F0132 0F5913FF FFFFFFEF 924000A2
EXT_CSD revision: 1.6 (MMC v4.5, v4.51)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 7.28 GiB(7,818,182,656 bytes)
Cache size: 256 KiB
Partition configuration: 0x08
No boot acknowledge is sent (default)
Boot partition 1 is enabled for boot
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x00
Boot area write protection: 0x00
Power-on write protection: possible
Permanent write protection: possible
Lock status: not locked

ANDROID System Info:
platform: sc8830, cpu abi: armeabi-v7a
manufacturer: samsung
board: SC7730SE, name: grandprimeve3gxx
brand: samsung, model: SM-G531H
build id: LMY48B, version: 5.1.1 Lollipop (LMY48B.FA51_G531HXXU0APB2)
build description: grandprimeve3gxx-user 5.1.1 LMY48B FA51_G531HXXU0APB2 release-keys

Internal storage: 5.47 GiB
crypto state: unencrypted
Selected: [Micron] (JWA60)MT29TZZZ8D5BKFAH-125W/8GB (BGA221)





Connection status: XHCI:HUB3:USB 2.0 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8840-4224
Boot version: 1.04, FW version: 1.12 (Jun 7 2018 00:06:47)
Insertion test... Done.
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 4MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0xFE (Micron)
Product name: P1J95K (0x50314a39354b), rev: 0x13, serial number: 0x7271E1AB
Manufacturing date: Jul 2015
CID: FE014E50 314A3935 4B137271 E1AB7240
CSD: D07F0132 0F5913FF FFFFFFEF 924000A2
EXT_CSD revision: 1.6 (MMC v4.5, v4.51)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 7.28 GiB(7,818,182,656 bytes)

Re-partitioning... Done.
Writing MBR, GPT at 0x00000000-0x000043FF (34 sectors)... Done in 0.057 s
Processing file: "BL_G531HDXS0AQC1_CL1143454_QB12737076_REV01_user_low_ship.tar.md5\spl.img", size: 32 KiB...
Extracting tar spl.img... Done.
Current partition access:
Access to boot partition 1
Writing BOOT at 0x00000000-0x0007FFFF (1024 sectors)... Done in 2.173 s
Processing file: "GRANDPRIMEVE3G_EUR_OPEN.pit\GRANDPRIMEVE3G.pit", size: 5.02 KiB...
Current partition access:
Access to user area
Writing PIT at 0x00080000-0x000FFFFF (11 sectors)... Done in 0.049 s
Processing file: "BL_G531HDXS0AQC1_CL1143454_QB12737076_REV01_user_low_ship.tar.md5\sboot.bin", size: 1.50 MiB...
Extracting tar sboot.bin... Done.
Writing SBOOT at 0x00400000-0x005FFFFF (4096 sectors)... Done in 4.443 s
Processing file: "BL_G531HDXS0AQC1_CL1143454_QB12737076_REV01_user_low_ship.tar.md5\sboot2.bin", size: 1.50 MiB...
Extracting tar sboot2.bin... Done.
Writing SBOOT2 at 0x00600000-0x007FFFFF (4096 sectors)... Done in 4.441 s
Processing file: "BL_G531HDXS0AQC1_CL1143454_QB12737076_REV01_user_low_ship.tar.md5\param.lfs", size: 560 KiB...
Extracting tar param.lfs... Done.
Writing PARAM at 0x02900000-0x02AFFFFF (4096 sectors)... Done in 4.440 s
Writing boot partition config to 0x08... Done.



IMG_20181205_194836.jpgIMG_20181205_101944.jpgIMG_20181206_102622.jpg
 

ferouzkassim

Member
Oct 11, 2018
7
8
Skype
ferouz_kassim
UFI REPAIR FAILED TO MOUNT ERRORS

IMG_20181205_194836.jpg
Connection status: XHCI:HUB3:USB 2.0 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8840-4224
Boot version: 1.04, FW version: 1.12 (Jun 7 2018 00:06:47)
Insertion test... Done.
Init bus...
VCC: 2.8 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 4MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0xFE (Micron)
Product name: P1J95K (0x50314a39354b), rev: 0x13, serial number: 0x7271E1AB
Manufacturing date: Jul 2015
CID: FE014E50 314A3935 4B137271 E1AB7240
CSD: D07F0132 0F5913FF FFFFFFEF 924000A2
EXT_CSD revision: 1.6 (MMC v4.5, v4.51)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 7.28 GiB(7,818,182,656 bytes)
Cache size: 256 KiB
Partition configuration: 0x08
No boot acknowledge is sent (default)
Boot partition 1 is enabled for boot
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x00
Boot area write protection: 0x00
Power-on write protection: possible
Permanent write protection: possible
Lock status: not locked

ANDROID System Info:
platform: sc8830, cpu abi: armeabi-v7a
manufacturer: samsung
board: SC7730SE, name: grandprimeve3gxx
brand: samsung, model: SM-G531H
build id: LMY48B, version: 5.1.1 Lollipop (LMY48B.FA51_G531HXXU0APB2)
build description: grandprimeve3gxx-user 5.1.1 LMY48B FA51_G531HXXU0APB2 release-keys

Internal storage: 5.47 GiB
crypto state: unencrypted
Selected: [Micron] (JWA60)MT29TZZZ8D5BKFAH-125W/8GB (BGA221)





Connection status: XHCI:HUB3:USB 2.0 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8840-4224
Boot version: 1.04, FW version: 1.12 (Jun 7 2018 00:06:47)
Insertion test... Done.
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 4MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0xFE (Micron)
Product name: P1J95K (0x50314a39354b), rev: 0x13, serial number: 0x7271E1AB
Manufacturing date: Jul 2015
CID: FE014E50 314A3935 4B137271 E1AB7240
CSD: D07F0132 0F5913FF FFFFFFEF 924000A2
EXT_CSD revision: 1.6 (MMC v4.5, v4.51)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 7.28 GiB(7,818,182,656 bytes)

Re-partitioning... Done.
Writing MBR, GPT at 0x00000000-0x000043FF (34 sectors)... Done in 0.057 s
Processing file: "BL_G531HDXS0AQC1_CL1143454_QB12737076_REV01_user_low_ship.tar.md5\spl.img", size: 32 KiB...
Extracting tar spl.img... Done.
Current partition access:
Access to boot partition 1
Writing BOOT at 0x00000000-0x0007FFFF (1024 sectors)... Done in 2.173 s
Processing file: "GRANDPRIMEVE3G_EUR_OPEN.pit\GRANDPRIMEVE3G.pit", size: 5.02 KiB...
Current partition access:
Access to user area
Writing PIT at 0x00080000-0x000FFFFF (11 sectors)... Done in 0.049 s
Processing file: "BL_G531HDXS0AQC1_CL1143454_QB12737076_REV01_user_low_ship.tar.md5\sboot.bin", size: 1.50 MiB...
Extracting tar sboot.bin... Done.
Writing SBOOT at 0x00400000-0x005FFFFF (4096 sectors)... Done in 4.443 s
Processing file: "BL_G531HDXS0AQC1_CL1143454_QB12737076_REV01_user_low_ship.tar.md5\sboot2.bin", size: 1.50 MiB...
Extracting tar sboot2.bin... Done.
Writing SBOOT2 at 0x00600000-0x007FFFFF (4096 sectors)... Done in 4.441 s
Processing file: "BL_G531HDXS0AQC1_CL1143454_QB12737076_REV01_user_low_ship.tar.md5\param.lfs", size: 560 KiB...
Extracting tar param.lfs... Done.
Writing PARAM at 0x02900000-0x02AFFFFF (4096 sectors)... Done in 4.440 s
Writing boot partition config to 0x08... Done.IMG_20181205_101944.jpgIMG_20181206_102622.jpg
 

salar

Member
Nov 9, 2018
5
2
iran
repaire imei huawei y560-u02 spreadtrum after change emmc:supper:

Using Port: SPRD U2S Diag (COM56)
Connecting to Diag port...
Power off the phone and connect USB cable.
Scanning Diag port... Done.
Detected SPRD U2S Diag (COM56)
Connection status: EHCI:HUB:HUB:USB 2.0 Full-Speed
USB Driver: [DriverCoding Corporation] sprdvcom, version: 2.0.0.114, date: 6-27-2014
Switching test mode... Done.
Scanning Diag port... Done.
Detected SPRD U2S Diag (COM56)
Connection status: EHCI:HUB:HUB:USB 2.0 Full-Speed
USB Driver: [DriverCoding Corporation] sprdvcom, version: 2.0.0.114, date: 6-27-2014
Writing imei...
imei[1]: xxx035083138132
imei[2]: xxx035083138140
Done.
 
Reactions: waqas_ali6012003

salar

Member
Nov 9, 2018
5
2
iran
change emmc asus t00f a500cg.
programing emmc and flash eng frimware and repair imei with ufi done.
Firmware package: CSC_Image_A500CG_20141219_2
Processing fastboot flashing on ASUS Android Bootloader Interface[0123456789]
Flashing in progress. Do not turn off the device !!!
oem start_partitioning
OKAY [ 0.986s]
Flashing /tmp/partition.tbl: partition.tbl (1.24 KiB)
sending '/tmp/partition.tbl' (1 KB)... OKAY [ 0.495s]
writing '/tmp/partition.tbl'... OKAY [ 0.753s]
oem partition /tmp/partition.tbl
OKAY [ 0.844s]
erase config
erasing 'config'... OKAY [ 16.327s]
erase system
erasing 'system'... OKAY [ 3.157s]
erase cache
erasing 'cache'... OKAY [ 1.708s]
erase data
erasing 'data'... OKAY [ 12.116s]
erase APD
erasing 'APD'... OKAY [ 8.034s]
erase ADF
erasing 'ADF'... OKAY [ 0.971s]
oem stop_partitioning
OKAY [ 0.798s]
Flashing dnx: sec-dnx_fwr.bin (96.97 KiB)
sending 'dnx' (96 KB)... OKAY [ 0.499s]
writing 'dnx'... OKAY [ 0.741s]
Flashing ifwi: sec-ifwi-prod.bin (1.94 MiB)
sending 'ifwi' (1983 KB)... OKAY [ 0.687s]
writing 'ifwi'... OKAY [ 0.905s]
Flashing boot: boot_sign.bin (8.91 MiB)
sending 'boot' (9120 KB)... OKAY [ 1.326s]
writing 'boot'... (bootloader) secure device
(bootloader) signed image
OKAY [ 1.871s]
Flashing recovery: recovery_sign.bin (10.85 MiB)
sending 'recovery' (11109 KB)... OKAY [ 1.454s]
writing 'recovery'... (bootloader) secure device
(bootloader) signed image
OKAY [ 2.098s]
Flashing fastboot: droidboot_sign.bin (12.25 MiB)
sending 'fastboot' (12540 KB)... OKAY [ 1.569s]
writing 'fastboot'... (bootloader) secure device
(bootloader) signed image
OKAY [ 2.218s]
Flashing splashscreen: splash_sign.bin (5.68 MiB)
sending 'splashscreen' (5814 KB)... OKAY [ 0.995s]
writing 'splashscreen'... (bootloader) secure device
(bootloader) signed image
OKAY [ 1.485s]
Flashing APD: APD.img (136.02 MiB)
sending 'APD' (139284 KB)... OKAY [ 13.287s]
writing 'APD'... OKAY [ 5.324s]
Flashing system: system.img (578.54 MiB)
sending 'system' (592422 KB)... OKAY [ 67.609s]
writing 'system'... OKAY [ 24.899s]
reboot
rebooting... Fastboot flashing completed in 3 mins 10.304 s
Waiting for ADB to be ready... Done.
Using Port: Intel Android Virtual Com Port (COM72)
New imei[1]: 35XXX2065224375
New imei[2]: 35XXX2065224367
Writing new imei... Done.
Rebooting device... Done.
Waiting for ADB to be ready... Done.
Synchronizing calibration data... Done.
 
Reactions: abo anas zayan