phone is hang on logo i flashed phone after flash baseband unknown i forgot to backup security file plz help
Connection status: EHCI:HUB:HUB[#2]:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8844-1803
Boot version: 1.05, FW version: 1.14 (Aug 25 2021 04:56:05)
Insertion test... Done
Init bus...
VCC: 3.3 V, VCCQ: 3.0 V
Bus: 8 bit (HS SDR 52MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x90 (SK Hynix)
Product name: HAG4a2 (0x484147346132), rev: 0xA5, serial number: 0xC79729F7
Manufacturing date: Sep 2018
CID: 90014A48 41473461 32A5C797 29F7954A
CSD: D0270132 8F5903FF FFFFFFE7 8A400016
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4 MiB
Boot2: 4 MiB
RPMB: 4 MiB [Provisioned, counter: 1260569]
User area: 14.68 GiB(15,758,000,128 bytes)
Cache size: 1 MiB
Hardware reset function: 1
Partition configuration: 0x38
No boot acknowledge is sent (default)
User area is enabled for boot
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning completed
Boot configuration protection: 0x00
Boot bus conditions: 0x00
Boot area write protection: 0x00
ANDROID System Info:
platform: msm8953, cpu abi: arm64-v8a
manufacturer: OPPO
board: msm8953, name: RMX1805
brand: OPPO, model: RMX1805 (realme 2)
build model list: RMX1809 (realme 2), RMX1811 (realme C1), RMX1805 (realme 2)
build id: PKQ1.190319.001, version: 9 [Pie] (RMX1805EX_11_A.71)
build description: S88051AA1-user 9 PKQ1.190319.001 eng.root.20201120.092029 release-keys
crypto state: encrypted?
eMMC selected: [HYNIX] H9TQ17ABJTACUR ID90/16GB (BGA221)
Connection status: EHCI:HUB:HUB[#2]:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8844-1803
Boot version: 1.05, FW version: 1.14 (Aug 25 2021 04:56:05)
Insertion test... Done
Init bus...
VCC: 3.3 V, VCCQ: 3.0 V
Bus: 8 bit (HS SDR 52MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x90 (SK Hynix)
Product name: HAG4a2 (0x484147346132), rev: 0xA5, serial number: 0xC79729F7
Manufacturing date: Sep 2018
CID: 90014A48 41473461 32A5C797 29F7954A
CSD: D0270132 8F5903FF FFFFFFE7 8A400016
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4 MiB
Boot2: 4 MiB
RPMB: 4 MiB [Provisioned, counter: 1260569]
User area: 14.68 GiB(15,758,000,128 bytes)
Cache size: 1 MiB
Hardware reset function: 1
Partition configuration: 0x38
No boot acknowledge is sent (default)
User area is enabled for boot
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning completed
Boot configuration protection: 0x00
Boot bus conditions: 0x00
Boot area write protection: 0x00
ANDROID System Info:
platform: msm8953, cpu abi: arm64-v8a
manufacturer: OPPO
board: msm8953, name: RMX1805
brand: OPPO, model: RMX1805 (realme 2)
build model list: RMX1809 (realme 2), RMX1811 (realme C1), RMX1805 (realme 2)
build id: PKQ1.190319.001, version: 9 [Pie] (RMX1805EX_11_A.71)
build description: S88051AA1-user 9 PKQ1.190319.001 eng.root.20201120.092029 release-keys
crypto state: encrypted?
eMMC selected: [HYNIX] H9TQ17ABJTACUR ID90/16GB (BGA221)