HOT oppo A3s remove pattern unlock frp without data loss

jaanjaan

Friend's Martview
Aug 26, 2017
296
127
punjab
Skype
[email protected]
Untitled.png
Connection status: EHCI:HUB[#5]:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8840-6385
Boot version: 1.04, FW version: 1.15 (Nov 8 2022 18:51:23)
Insertion test... Done
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 4MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: GP6BMB (0x475036424d42), rev: 0x01, serial number: 0xF93CF273
Manufacturing date: Oct 2019
CID: 15010047 5036424D 4201F93C F273A6E6
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
Firmware version: 0x05
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4 MiB
Boot2: 4 MiB
RPMB: 16 MiB [Provisioned, counter: 88062]
User area: 58.24 GiB(62,537,072,640 bytes)
Cache size: 64 MiB
Hardware reset function: 1
Secure Write Protect Information: 0x01
Secure Feature support: 0x55
Partition configuration: 0x38
No boot acknowledge is sent (default)
User area is enabled for boot
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x00
Boot area write protection: 0x00
platform: msm8953, cpu abi: arm64-v8a
manufacturer: OPPO
board: msm8953, name: PBBM00
brand: OPPO, model: PBBM00 (R11s)
build id: OPM1.171019.026, version: 8.1.0 [Oreo] (PBBM00EX_11_A.39)
build description: S88051AA1-user 8.1.0 OPM1.171019.026 eng.root.20201227.212730 release-keys
crypto state: encrypted?
EXT_CSD backup saved to "\\%BACKUPS%\GP6BMB_F93CF273.ext_csd"
eMMC detected: [SAMSUNG] KMGP6001BM-BXXX/64GB
Connection status: EHCI:HUB[#5]:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8840-6385
Boot version: 1.04, FW version: 1.15 (Nov 8 2022 18:51:23)
Insertion test... Done
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 4MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: GP6BMB (0x475036424d42), rev: 0x01, serial number: 0xF93CF273
Manufacturing date: Oct 2019
CID: 15010047 5036424D 4201F93C F273A6E6
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
Firmware version: 0x05
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4 MiB
Boot2: 4 MiB
RPMB: 16 MiB
User area: 58.24 GiB(62,537,072,640 bytes)
MasterClear [2]... Done
Connection status: EHCI:HUB[#5]:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8840-6385
Boot version: 1.04, FW version: 1.15 (Nov 8 2022 18:51:23)
Insertion test... Done
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 4MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: GP6BMB (0x475036424d42), rev: 0x01, serial number: 0xF93CF273
Manufacturing date: Oct 2019
CID: 15010047 5036424D 4201F93C F273A6E6
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
Firmware version: 0x05
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4 MiB
Boot2: 4 MiB
RPMB: 16 MiB
User area: 58.24 GiB(62,537,072,640 bytes)
Clear FRP Lock... Done
 
Top