Interface: UFI High-Speed
Serial number: 0011-8839-8827
Boot version: 1.04, FW version: 1.12 (Jun 7 2018 00:06:47)
Insertion test... Done.
VCCQ not properly connected
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 4MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: QE63MB (0x514536334d42), rev: 0x06, serial number: 0xDBE8DEFE
Manufacturing date: Nov 2018
CID: 15010051 4536334D 4206DBE8 DEFEB5A6
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 14.56 GiB(15,634,268,160 bytes)
Factory Reset...
Creating filesystem... Done.
Writing cache... Done.
Creating filesystem... Done.
Writing userdata... Done.
Done.
Connection status: EHCI:HUB:HUB:HUB:USB 2.0 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8839-8827
Boot version: 1.04, FW version: 1.12 (Jun 7 2018 00:06:47)
Insertion test... Done.
VCCQ not properly connected
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 4MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: QE63MB (0x514536334d42), rev: 0x06, serial number: 0xDBE8DEFE
Manufacturing date: Nov 2018
CID: 15010051 4536334D 4206DBE8 DEFEB5A6
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 14.56 GiB(15,634,268,160 bytes)
Cache size: 64 MiB
Hardware reset function: 1
Partition configuration: 0x38
No boot acknowledge is sent (default)
User area is enabled for boot
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x00
Boot area write protection: 0x00
Power-on write protection: possible
Permanent write protection: possible
Lock status: not locked
ANDROID System Info:
platform: msm8953, cpu abi: arm64-v8a
manufacturer: OPPO
board: msm8953, name: RMX1809
brand: OPPO, model: RMX1809(Realme 2)
build id: OPM1.171019.026, version: 8.1.0 Oreo (RMX1809EX_11_A.24)
build description: S88051AA1-user 8.1.0 OPM1.171019.026 eng.root.20190222.123456 release-keys
Internal storage: 9.13 GiB
crypto state: unencrypted
Custom moviNAND command is not supported for this device(MMC51).
Selected: [SAMSUNG] KMQE60013M-B318/16GB+LPDDR3 16Gb (BGA221)
Serial number: 0011-8839-8827
Boot version: 1.04, FW version: 1.12 (Jun 7 2018 00:06:47)
Insertion test... Done.
VCCQ not properly connected
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 4MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: QE63MB (0x514536334d42), rev: 0x06, serial number: 0xDBE8DEFE
Manufacturing date: Nov 2018
CID: 15010051 4536334D 4206DBE8 DEFEB5A6
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 14.56 GiB(15,634,268,160 bytes)
Factory Reset...
Creating filesystem... Done.
Writing cache... Done.
Creating filesystem... Done.
Writing userdata... Done.
Done.
Connection status: EHCI:HUB:HUB:HUB:USB 2.0 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8839-8827
Boot version: 1.04, FW version: 1.12 (Jun 7 2018 00:06:47)
Insertion test... Done.
VCCQ not properly connected
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 4MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: QE63MB (0x514536334d42), rev: 0x06, serial number: 0xDBE8DEFE
Manufacturing date: Nov 2018
CID: 15010051 4536334D 4206DBE8 DEFEB5A6
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 14.56 GiB(15,634,268,160 bytes)
Cache size: 64 MiB
Hardware reset function: 1
Partition configuration: 0x38
No boot acknowledge is sent (default)
User area is enabled for boot
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x00
Boot area write protection: 0x00
Power-on write protection: possible
Permanent write protection: possible
Lock status: not locked
ANDROID System Info:
platform: msm8953, cpu abi: arm64-v8a
manufacturer: OPPO
board: msm8953, name: RMX1809
brand: OPPO, model: RMX1809(Realme 2)
build id: OPM1.171019.026, version: 8.1.0 Oreo (RMX1809EX_11_A.24)
build description: S88051AA1-user 8.1.0 OPM1.171019.026 eng.root.20190222.123456 release-keys
Internal storage: 9.13 GiB
crypto state: unencrypted
Custom moviNAND command is not supported for this device(MMC51).
Selected: [SAMSUNG] KMQE60013M-B318/16GB+LPDDR3 16Gb (BGA221)
