HOT SAMSUNG GALAXY J7 PRIME G610F DEAD BOOT REPAIR UFI BOX

[jaanjaan]

Samsung Galaxy J7 Prime G610f

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Connection status: EHCI:HUB[#2]:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8840-6385
Boot version: 1.04, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... Done
Init bus...
VCC: 3.3 V, VCCQ: 3.0 V
Bus: 8 bit (HS SDR 24MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: AJNB3R (0x414a4e423352), rev: 0x03, serial number: 0xF05BEA9B
Manufacturing date: Sep 2016
CID: 15010041 4A4E4233 5203F05B EA9B939E
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.7 (MMC v5.0, v5.01)
Partition info:
Boot1: 4 MiB
Boot2: 4 MiB
RPMB: 4 MiB [Provisioned, counter: 2]
User area: 14.68 GiB(15,758,000,128 bytes)
Cache size: 64 MiB
Partition configuration: 0x48
Boot acknowledge is sent during the boot operation
Boot partition 1 is enabled for boot
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x01
Bus width: x4 (sdr/ddr), boot mode: sdr(default), reset bus width to x1 sdr(default)
Boot area write protection: 0x00
User area write protection: 0x10
Password protection features: enabled
Power-on write protection: possible
Permanent write protection: not possible
Lock status: not locked

ANDROID System Info:
platform: exynos5, cpu abi: armeabi-v7a
manufacturer: samsung
board: universal7870, name: on7xeltedd
brand: samsung, model: SM-G610F
build model list: SM-G610F
build id: M1AJQ, version: 8.1.0 [Oreo] (M1AJQ.G610FDDU1CRJ4)
build description: on7xeltedd-user 8.1.0 M1AJQ G610FDDU1CRJ4 release-keys

crypto state: encrypted?
Detected: SAMSUNG moviNAND KMAJN000B3-RXXX/16G

Connection status: EHCI:HUB[#2]:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8840-6385
Boot version: 1.04, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... Done
Init bus...
VCC: 3.3 V, VCCQ: 3.0 V
Bus: 8 bit (HS SDR 24MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: AJNB3R (0x414a4e423352), rev: 0x03, serial number: 0xF05BEA9B
Manufacturing date: Sep 2016
CID: 15010041 4A4E4233 5203F05B EA9B939E
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.7 (MMC v5.0, v5.01)
Partition info:
Boot1: 4 MiB
Boot2: 4 MiB
RPMB: 4 MiB [Provisioned, counter: 2]
User area: 14.68 GiB(15,758,000,128 bytes)

Current partition access:
Access to boot partition 1
Reading boot1, size: 4 MiB... Done in 0.558 s
File saved to "\\%BACKUPS%\samsung\SM-G610F(M1AJQ.G610FDDU1CRJ4-8.1.0-M1AJQ)[AJNB3R_F05BEA9B]\boot1.bin" (CRC32: 0x579036D0)
Blank checking: NOT blank
Current partition access:
Access to boot partition 2
Reading boot2, size: 4 MiB... Done in 0.542 s
File saved to "\\%BACKUPS%\samsung\SM-G610F(M1AJQ.G610FDDU1CRJ4-8.1.0-M1AJQ)[AJNB3R_F05BEA9B]\boot2.bin" (CRC32: 0x9C522C95)
Blank checking: NOT blank
Current partition access:
Access to user area
Reading userarea, size: 128 MiB... Done in 20.785 s
File saved to "\\%BACKUPS%\samsung\SM-G610F(M1AJQ.G610FDDU1CRJ4-8.1.0-M1AJQ)[AJNB3R_F05BEA9B]\userarea_128MiB.bin" (CRC32: 0x052C8AA3)
Blank checking: NOT blank

download dump file
this information only dump file
for boot repair goto factory image tab
select samsung
now put drug and drop
pit+bl file and write
now your phone show donload mode
open odin and flash 4file firmware.
doqnload dump file
download

 

[askerhakan]

Samsung Galaxy J7 Prime G610f

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Connection status: EHCI:HUB[#2]:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8840-6385
Boot version: 1.04, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... Done
Init bus...
VCC: 3.3 V, VCCQ: 3.0 V
Bus: 8 bit (HS SDR 24MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: AJNB3R (0x414a4e423352), rev: 0x03, serial number: 0xF05BEA9B
Manufacturing date: Sep 2016
CID: 15010041 4A4E4233 5203F05B EA9B939E
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.7 (MMC v5.0, v5.01)
Partition info:
Boot1: 4 MiB
Boot2: 4 MiB
RPMB: 4 MiB [Provisioned, counter: 2]
User area: 14.68 GiB(15,758,000,128 bytes)
Cache size: 64 MiB
Partition configuration: 0x48
Boot acknowledge is sent during the boot operation
Boot partition 1 is enabled for boot
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x01
Bus width: x4 (sdr/ddr), boot mode: sdr(default), reset bus width to x1 sdr(default)
Boot area write protection: 0x00
User area write protection: 0x10
Password protection features: enabled
Power-on write protection: possible
Permanent write protection: not possible
Lock status: not locked

ANDROID System Info:
platform: exynos5, cpu abi: armeabi-v7a
manufacturer: samsung
board: universal7870, name: on7xeltedd
brand: samsung, model: SM-G610F
build model list: SM-G610F
build id: M1AJQ, version: 8.1.0 [Oreo] (M1AJQ.G610FDDU1CRJ4)
build description: on7xeltedd-user 8.1.0 M1AJQ G610FDDU1CRJ4 release-keys

crypto state: encrypted?
Detected: SAMSUNG moviNAND KMAJN000B3-RXXX/16G

Connection status: EHCI:HUB[#2]:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8840-6385
Boot version: 1.04, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... Done
Init bus...
VCC: 3.3 V, VCCQ: 3.0 V
Bus: 8 bit (HS SDR 24MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: AJNB3R (0x414a4e423352), rev: 0x03, serial number: 0xF05BEA9B
Manufacturing date: Sep 2016
CID: 15010041 4A4E4233 5203F05B EA9B939E
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.7 (MMC v5.0, v5.01)
Partition info:
Boot1: 4 MiB
Boot2: 4 MiB
RPMB: 4 MiB [Provisioned, counter: 2]
User area: 14.68 GiB(15,758,000,128 bytes)

Current partition access:
Access to boot partition 1
Reading boot1, size: 4 MiB... Done in 0.558 s
File saved to "\\%BACKUPS%\samsung\SM-G610F(M1AJQ.G610FDDU1CRJ4-8.1.0-M1AJQ)[AJNB3R_F05BEA9B]\boot1.bin" (CRC32: 0x579036D0)
Blank checking: NOT blank
Current partition access:
Access to boot partition 2
Reading boot2, size: 4 MiB... Done in 0.542 s
File saved to "\\%BACKUPS%\samsung\SM-G610F(M1AJQ.G610FDDU1CRJ4-8.1.0-M1AJQ)[AJNB3R_F05BEA9B]\boot2.bin" (CRC32: 0x9C522C95)
Blank checking: NOT blank
Current partition access:
Access to user area
Reading userarea, size: 128 MiB... Done in 20.785 s
File saved to "\\%BACKUPS%\samsung\SM-G610F(M1AJQ.G610FDDU1CRJ4-8.1.0-M1AJQ)[AJNB3R_F05BEA9B]\userarea_128MiB.bin" (CRC32: 0x052C8AA3)
Blank checking: NOT blank

download dump file
this information only dump file
for boot repair goto factory image tab
select samsung
now put drug and drop
pit+bl file and write
now your phone show donload mode
open odin and flash 4file firmware.
doqnload dump file
download

This emmc factory reset and write dump file or samsung factory frimware pit+bl but brick phone, not open, this pc phone ekinox driver see, I am sorry

 

[jaanjaan]

This emmc factory reset and write dump file or samsung factory frimware pit+bl but brick phone, not open, this pc phone ekinox driver see, I am sorry

borther identify emmc and make backup unicq files then factory erase and erase and repartion emmc then write dump next write pit+bl and unicq file your phone is go to download mode now open odin and select 4file firmware and wirte good luck.

 

[Mughal44]

File link please

 

[cules]

where is file bro

 

[Saad_ikram]

Samsung Galaxy J7 Prime G610f

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Please login to view image

Connection status: EHCI:HUB[#2]:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8840-6385
Boot version: 1.04, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... Done
Init bus...
VCC: 3.3 V, VCCQ: 3.0 V
Bus: 8 bit (HS SDR 24MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: AJNB3R (0x414a4e423352), rev: 0x03, serial number: 0xF05BEA9B
Manufacturing date: Sep 2016
CID: 15010041 4A4E4233 5203F05B EA9B939E
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.7 (MMC v5.0, v5.01)
Partition info:
Boot1: 4 MiB
Boot2: 4 MiB
RPMB: 4 MiB [Provisioned, counter: 2]
User area: 14.68 GiB(15,758,000,128 bytes)
Cache size: 64 MiB
Partition configuration: 0x48
Boot acknowledge is sent during the boot operation
Boot partition 1 is enabled for boot
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x01
Bus width: x4 (sdr/ddr), boot mode: sdr(default), reset bus width to x1 sdr(default)
Boot area write protection: 0x00
User area write protection: 0x10
Password protection features: enabled
Power-on write protection: possible
Permanent write protection: not possible
Lock status: not locked

ANDROID System Info:
platform: exynos5, cpu abi: armeabi-v7a
manufacturer: samsung
board: universal7870, name: on7xeltedd
brand: samsung, model: SM-G610F
build model list: SM-G610F
build id: M1AJQ, version: 8.1.0 [Oreo] (M1AJQ.G610FDDU1CRJ4)
build description: on7xeltedd-user 8.1.0 M1AJQ G610FDDU1CRJ4 release-keys

crypto state: encrypted?
Detected: SAMSUNG moviNAND KMAJN000B3-RXXX/16G

Connection status: EHCI:HUB[#2]:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8840-6385
Boot version: 1.04, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... Done
Init bus...
VCC: 3.3 V, VCCQ: 3.0 V
Bus: 8 bit (HS SDR 24MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: AJNB3R (0x414a4e423352), rev: 0x03, serial number: 0xF05BEA9B
Manufacturing date: Sep 2016
CID: 15010041 4A4E4233 5203F05B EA9B939E
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.7 (MMC v5.0, v5.01)
Partition info:
Boot1: 4 MiB
Boot2: 4 MiB
RPMB: 4 MiB [Provisioned, counter: 2]
User area: 14.68 GiB(15,758,000,128 bytes)

Current partition access:
Access to boot partition 1
Reading boot1, size: 4 MiB... Done in 0.558 s
File saved to "\\%BACKUPS%\samsung\SM-G610F(M1AJQ.G610FDDU1CRJ4-8.1.0-M1AJQ)[AJNB3R_F05BEA9B]\boot1.bin" (CRC32: 0x579036D0)
Blank checking: NOT blank
Current partition access:
Access to boot partition 2
Reading boot2, size: 4 MiB... Done in 0.542 s
File saved to "\\%BACKUPS%\samsung\SM-G610F(M1AJQ.G610FDDU1CRJ4-8.1.0-M1AJQ)[AJNB3R_F05BEA9B]\boot2.bin" (CRC32: 0x9C522C95)
Blank checking: NOT blank
Current partition access:
Access to user area
Reading userarea, size: 128 MiB... Done in 20.785 s
File saved to "\\%BACKUPS%\samsung\SM-G610F(M1AJQ.G610FDDU1CRJ4-8.1.0-M1AJQ)[AJNB3R_F05BEA9B]\userarea_128MiB.bin" (CRC32: 0x052C8AA3)
Blank checking: NOT blank

download dump file
this information only dump file
for boot repair goto factory image tab
select samsung
now put drug and drop
pit+bl file and write
now your phone show donload mode
open odin and flash 4file firmware.
doqnload dump file
download

Sir Please share sm-g610f dump files with me

 

[Shuklamobile]

emmc change possible