Connection status: EHCI:HUB:HUB[#5]:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8843-2344
Boot version: 1.05, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... Done
Init bus...
VCC: 3.3 V, VCCQ: 3.0 V
Bus: 8 bit (HS SDR 52MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x45 (SanDisk)
Product name: SEM08G (0x53454d303847), rev: 0x1D, serial number: 0x03B333C3
Manufacturing date: Jan 2015
CID: 45010053 454D3038 471D03B3 33C3125A
CSD: D0270132 0F5903FF F6DBFFFF 8E40406C
EXT_CSD revision: 1.6 (MMC v4.5, v4.51)
Partition info:
Boot1: 2 MiB
Boot2: 2 MiB
RPMB: 2 MiB [Authentication Key not yet programmed]
User area: 14.68 GiB(15,758,000,128 bytes)
Cache size: 64 MiB
Hardware reset function: 1
Secure Feature support: 0x55
Partition configuration: 0x48
Boot acknowledge is sent during the boot operation
Boot partition 1 is enabled for boot
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x01
Bus width: x4 (sdr/ddr), boot mode: sdr(default), reset bus width to x1 sdr(default)
Boot area write protection: 0x10
Power-on write protection: possible
Permanent write protection: not possible
Lock status: not locked
ANDROID System Info:
platform: exynos4, cpu abi: armeabi-v7a
manufacturer: samsung
board: smdk4x12, name: mproject3gxx
brand: samsung, model: SM-C101
build id: JDQ39, version: 4.3 [Jelly Bean] (JDQ39.C101XWUAMK4)
build description: mproject3gxx-user 4.2.2 JDQ39 C101XWUAMK4 release-keys
Internal storage: 5.44 GiB
crypto state: unencrypted
eMMC selected: [SanDisk] SD5D26B-8G (BGA162)
Interface: UFI High-Speed
Serial number: 0011-8843-2344
Boot version: 1.05, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... Done
Init bus...
VCC: 3.3 V, VCCQ: 3.0 V
Bus: 8 bit (HS SDR 52MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x45 (SanDisk)
Product name: SEM08G (0x53454d303847), rev: 0x1D, serial number: 0x03B333C3
Manufacturing date: Jan 2015
CID: 45010053 454D3038 471D03B3 33C3125A
CSD: D0270132 0F5903FF F6DBFFFF 8E40406C
EXT_CSD revision: 1.6 (MMC v4.5, v4.51)
Partition info:
Boot1: 2 MiB
Boot2: 2 MiB
RPMB: 2 MiB [Authentication Key not yet programmed]
User area: 14.68 GiB(15,758,000,128 bytes)
Cache size: 64 MiB
Hardware reset function: 1
Secure Feature support: 0x55
Partition configuration: 0x48
Boot acknowledge is sent during the boot operation
Boot partition 1 is enabled for boot
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x01
Bus width: x4 (sdr/ddr), boot mode: sdr(default), reset bus width to x1 sdr(default)
Boot area write protection: 0x10
Power-on write protection: possible
Permanent write protection: not possible
Lock status: not locked
ANDROID System Info:
platform: exynos4, cpu abi: armeabi-v7a
manufacturer: samsung
board: smdk4x12, name: mproject3gxx
brand: samsung, model: SM-C101
build id: JDQ39, version: 4.3 [Jelly Bean] (JDQ39.C101XWUAMK4)
build description: mproject3gxx-user 4.2.2 JDQ39 C101XWUAMK4 release-keys
Internal storage: 5.44 GiB
crypto state: unencrypted
eMMC selected: [SanDisk] SD5D26B-8G (BGA162)