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vivo v15 pro brick

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siang8788

Active Member
Sep 18, 2017
25
3
malaysia
hi,v15 pro dead by erase userdata and frp partition.

log:

Connection status: XHCI:HUB3:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8840-2715
Boot version: 1.04, FW version: 1.12 (Jun 7 2018 00:06:47)
Insertion test... Done
VCCQ not properly connected
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 4MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: 3V6CMB (0x335636434d42), rev: 0x02, serial number: 0x2E756A50
Manufacturing date: Jan 2019
CID: 15010033 5636434D 42022E75 6A5016B6
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 16384 KiB
User area: 116.48 GiB(125,069,950,976 bytes)

Erasing frp at 0x27DD0000-0x27E4FFFF size: 512 KiB... Done in 0.006 s
Erasing userdata at 0x1E2200000-0x1D1EBFBDFF size: 108.95 GiB... Done in 14.194 s


how to solve?thanks
 
vishal3008N

vishal3008N

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Jul 25, 2017
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siang8788 said:
hi,v15 pro dead by erase userdata and frp partition.

log:

Connection status: XHCI:HUB3:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8840-2715
Boot version: 1.04, FW version: 1.12 (Jun 7 2018 00:06:47)
Insertion test... Done
VCCQ not properly connected
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 4MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: 3V6CMB (0x335636434d42), rev: 0x02, serial number: 0x2E756A50
Manufacturing date: Jan 2019
CID: 15010033 5636434D 42022E75 6A5016B6
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 16384 KiB
User area: 116.48 GiB(125,069,950,976 bytes)

Erasing frp at 0x27DD0000-0x27E4FFFF size: 512 KiB... Done in 0.006 s
Erasing userdata at 0x1E2200000-0x1D1EBFBDFF size: 108.95 GiB... Done in 14.194 s


how to solve?thanks
Click to expand...
show identify log
 
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S

siang8788

Active Member
Sep 18, 2017
25
3
malaysia
Connection status: XHCI:HUB3:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8840-2715
Boot version: 1.04, FW version: 1.12 (Jun 7 2018 00:06:47)
Insertion test... Done
VCCQ not properly connected
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 4MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: 3V6CMB (0x335636434d42), rev: 0x02, serial number: 0x2E756A50
Manufacturing date: Jan 2019
CID: 15010033 5636434D 42022E75 6A5016B6
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 16384 KiB
User area: 116.48 GiB(125,069,950,976 bytes)
Cache size: 64 MiB
Hardware reset function: 1
Partition configuration: 0x00
No boot acknowledge is sent (default)
Device is not boot-enabled (default)
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x00
Boot area write protection: 0x00
Power-on write protection: possible
Permanent write protection: possible
Lock status: not locked

ANDROID System Info:
platform: sm6150, cpu abi: arm64-v8a
manufacturer: vivo
board: sm6150, name: sm6150
brand: vivo, model: vivo 1818
build model list: vivo 1818
build id: PKQ1.190302.001, version: 9 Pie (PKQ1.190302.001 release-keys)
build description: sm6150-user 9 PKQ1.190302.001 compiler03202020 release-keys

crypto state: encrypted?
Custom moviNAND command is not supported for this device(MMC51).
Detected: SAMSUNG moviNAND KM3V6000CM-BXXX/128G
 
vishal3008N

vishal3008N

Product Supporter
Jul 25, 2017
160
626
haryana
Skype
live:gvishal3008
Sonork ID
0
PayPal:

Donate money to this user
siang8788 said:
Connection status: XHCI:HUB3:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8840-2715
Boot version: 1.04, FW version: 1.12 (Jun 7 2018 00:06:47)
Insertion test... Done
VCCQ not properly connected
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 4MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: 3V6CMB (0x335636434d42), rev: 0x02, serial number: 0x2E756A50
Manufacturing date: Jan 2019
CID: 15010033 5636434D 42022E75 6A5016B6
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 16384 KiB
User area: 116.48 GiB(125,069,950,976 bytes)
Cache size: 64 MiB
Hardware reset function: 1
Partition configuration: 0x00
No boot acknowledge is sent (default)
Device is not boot-enabled (default)
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x00
Boot area write protection: 0x00
Power-on write protection: possible
Permanent write protection: possible
Lock status: not locked

ANDROID System Info:
platform: sm6150, cpu abi: arm64-v8a
manufacturer: vivo
board: sm6150, name: sm6150
brand: vivo, model: vivo 1818
build model list: vivo 1818
build id: PKQ1.190302.001, version: 9 Pie (PKQ1.190302.001 release-keys)
build description: sm6150-user 9 PKQ1.190302.001 compiler03202020 release-keys

crypto state: encrypted?
Custom moviNAND command is not supported for this device(MMC51).
Detected: SAMSUNG moviNAND KM3V6000CM-BXXX/128G
Click to expand...
Write gernic quallcom CSD
 
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