Boot version: 1.05, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... Done
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 4MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x90 (SK Hynix)
Product name: hB8aP (0x68423861503e), rev: 0x01, serial number: 0x02800433
Manufacturing date: Apr 2019
CID: 90014A68 42386150 3E010280 0433461A
CSD: D0270032 8F5903FF FFFFFFEF 8E400042
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4 MiB
Boot2: 4 MiB
RPMB: 16 MiB
User area: 29.12 GiB(31,268,536,320 bytes)
Cache size: 2 MiB
Hardware reset function: 1
Partition configuration: 0x00
No boot acknowledge is sent (default)
Device is not boot-enabled (default)
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x00
Boot area write protection: 0x00
ANDROID System Info:
platform: msm8953, cpu abi: arm64-v8a
manufacturer: Xiaomi
board: msm8953, name: onc_eea
brand: xiaomi, model: Redmi 7
build id: QKQ1.191008.001, version: 10 [Android 10] ()
crypto state: encrypted?
EXT_CSD backup saved to "\\%BACKUPS%\hB8aP_02800433.ext_csd"
eMMC selected: [HYNIX] H9TQ27ADFTMCUR/32GB (BGA221)
Connection status: EHCI:HUB:HUB[#2]:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number:
Boot version: 1.05, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... Done
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 4MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x90 (SK Hynix)
Product name: hB8aP (0x68423861503e), rev: 0x01, serial number: 0x02800433
Manufacturing date: Apr 2019
CID: 90014A68 42386150 3E010280 0433461A
CSD: D0270032 8F5903FF FFFFFFEF 8E400042
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4 MiB
Boot2: 4 MiB
RPMB: 16 MiB
User area: 29.12 GiB(31,268,536,320 bytes)
Clear FRP Lock... Done
Connection status: EHCI:HUB:HUB[#2]:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number:
Boot version: 1.05, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... Done
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 4MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x90 (SK Hynix)
Product name: hB8aP (0x68423861503e), rev: 0x01, serial number: 0x02800433
Manufacturing date: Apr 2019
CID: 90014A68 42386150 3E010280 0433461A
CSD: D0270032 8F5903FF FFFFFFEF 8E400042
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4 MiB
Boot2: 4 MiB
RPMB: 16 MiB
User area: 29.12 GiB(31,268,536,320 bytes)
[Xiaomi] Reset Mi Account Lock... Done
Boot version: 1.05, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... Done
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 4MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x90 (SK Hynix)
Product name: hB8aP (0x68423861503e), rev: 0x01, serial number: 0x02800433
Manufacturing date: Apr 2019
CID: 90014A68 42386150 3E010280 0433461A
CSD: D0270032 8F5903FF FFFFFFEF 8E400042
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4 MiB
Boot2: 4 MiB
RPMB: 16 MiB
User area: 29.12 GiB(31,268,536,320 bytes)
Cache size: 2 MiB
Hardware reset function: 1
Partition configuration: 0x00
No boot acknowledge is sent (default)
Device is not boot-enabled (default)
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x00
Boot area write protection: 0x00
ANDROID System Info:
platform: msm8953, cpu abi: arm64-v8a
manufacturer: Xiaomi
board: msm8953, name: onc_eea
brand: xiaomi, model: Redmi 7
build id: QKQ1.191008.001, version: 10 [Android 10] ()
crypto state: encrypted?
EXT_CSD backup saved to "\\%BACKUPS%\hB8aP_02800433.ext_csd"
eMMC selected: [HYNIX] H9TQ27ADFTMCUR/32GB (BGA221)
Connection status: EHCI:HUB:HUB[#2]:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number:
Boot version: 1.05, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... Done
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 4MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x90 (SK Hynix)
Product name: hB8aP (0x68423861503e), rev: 0x01, serial number: 0x02800433
Manufacturing date: Apr 2019
CID: 90014A68 42386150 3E010280 0433461A
CSD: D0270032 8F5903FF FFFFFFEF 8E400042
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4 MiB
Boot2: 4 MiB
RPMB: 16 MiB
User area: 29.12 GiB(31,268,536,320 bytes)
Clear FRP Lock... Done
Connection status: EHCI:HUB:HUB[#2]:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number:
Boot version: 1.05, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... Done
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 4MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x90 (SK Hynix)
Product name: hB8aP (0x68423861503e), rev: 0x01, serial number: 0x02800433
Manufacturing date: Apr 2019
CID: 90014A68 42386150 3E010280 0433461A
CSD: D0270032 8F5903FF FFFFFFEF 8E400042
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4 MiB
Boot2: 4 MiB
RPMB: 16 MiB
User area: 29.12 GiB(31,268,536,320 bytes)
[Xiaomi] Reset Mi Account Lock... Done
