Interface: UFI High-Speed
Serial number: 0011-8839-5801
Boot version: 1.04, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... Done
VCC, VCCQ not properly connected
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 4MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: QX63AB (0x515836334142), rev: 0x00, serial number: 0x4D4E062D
Manufacturing date: сен 2021
CID: 15010051 58363341 42004D4E 062D9840
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
Firmware version: 0x03
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4 MiB
Boot2: 4 MiB
RPMB: 16 MiB [Provisioned, counter: 1360]
User area: 29.12 GiB(31,268,536,320 bytes)
Cache size: 64 MiB
Secure Feature support: 0x55
Partition configuration: 0x08
No boot acknowledge is sent (default)
Boot partition 1 is enabled for boot
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x00
Boot area write protection: 0x00
ANDROID System Info:
platform: , cpu abi: armeabi-v7a
board: , name:
brand: , model: build id: RP1A.201005.001, version: 11 [Android 11] (RP1A.201005.001.A032FXXU1AVB3)
build description: a3corexx-user 11 RP1A.201005.001 A032FXXU1AVB3 release-keys
crypto state: encrypted?
Internal storage: 16 MiB
crypto state: unencrypted
EXT_CSD backup saved to "\\%BACKUPS%\QX63AB_4D4E062D.ext_csd"
eMMC selected: [SAMSUNG] KMQX60013A-B419/32GB+LPDDR3 16Gb (BGA221)
Boot version: 1.04, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... Done
VCC, VCCQ not properly connected
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 4MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: QX63AB (0x515836334142), rev: 0x00, serial number: 0x4D4E062D
Manufacturing date: сен 2021
CID: 15010051 58363341 42004D4E 062D9840
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
Firmware version: 0x03
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4 MiB
Boot2: 4 MiB
RPMB: 16 MiB
User area: 29.12 GiB(31,268,536,320 bytes)
Erasing persistent at 0x04C00000-0x04CFFFFF size: 1 MiB... Done in 0.006 s
Serial number: 0011-8839-5801
Boot version: 1.04, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... Done
VCC, VCCQ not properly connected
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 4MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: QX63AB (0x515836334142), rev: 0x00, serial number: 0x4D4E062D
Manufacturing date: сен 2021
CID: 15010051 58363341 42004D4E 062D9840
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
Firmware version: 0x03
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4 MiB
Boot2: 4 MiB
RPMB: 16 MiB [Provisioned, counter: 1360]
User area: 29.12 GiB(31,268,536,320 bytes)
Cache size: 64 MiB
Secure Feature support: 0x55
Partition configuration: 0x08
No boot acknowledge is sent (default)
Boot partition 1 is enabled for boot
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x00
Boot area write protection: 0x00
ANDROID System Info:
platform: , cpu abi: armeabi-v7a
board: , name:
brand: , model: build id: RP1A.201005.001, version: 11 [Android 11] (RP1A.201005.001.A032FXXU1AVB3)
build description: a3corexx-user 11 RP1A.201005.001 A032FXXU1AVB3 release-keys
crypto state: encrypted?
Internal storage: 16 MiB
crypto state: unencrypted
EXT_CSD backup saved to "\\%BACKUPS%\QX63AB_4D4E062D.ext_csd"
eMMC selected: [SAMSUNG] KMQX60013A-B419/32GB+LPDDR3 16Gb (BGA221)
Boot version: 1.04, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... Done
VCC, VCCQ not properly connected
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 4MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: QX63AB (0x515836334142), rev: 0x00, serial number: 0x4D4E062D
Manufacturing date: сен 2021
CID: 15010051 58363341 42004D4E 062D9840
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
Firmware version: 0x03
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4 MiB
Boot2: 4 MiB
RPMB: 16 MiB
User area: 29.12 GiB(31,268,536,320 bytes)
Erasing persistent at 0x04C00000-0x04CFFFFF size: 1 MiB... Done in 0.006 s