Connection status: EHCI:HUB:HUB:USB 2.0 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8840-6758
Boot version: 1.04, FW version: 1.10 (Mar 26 2017 14:24:34)
Insertion test... Done.
VCCQ not properly connected
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 4MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: 3H6CAB (0x334836434142), rev: 0x02, serial number: 0x6F54CAD3
Manufacturing date: Sep 2018
CID: 15010033 48364341 42026F54 CAD3955E
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 16384 KiB
User area: 58.24 GiB(62,537,072,640 bytes)
Factory Reset...
Creating filesystem... Done.
Writing cache... Done.
Creating filesystem... Done.
Writing userdata... Unknown chunk type 0x0000 at 0x00E0F0C4
Wrote 40095703 blocks, expected to write 13239547 blocks
Done.
Done.
Interface: UFI High-Speed
Serial number: 0011-8840-6758
Boot version: 1.04, FW version: 1.10 (Mar 26 2017 14:24:34)
Insertion test... Done.
VCCQ not properly connected
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 4MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: 3H6CAB (0x334836434142), rev: 0x02, serial number: 0x6F54CAD3
Manufacturing date: Sep 2018
CID: 15010033 48364341 42026F54 CAD3955E
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 16384 KiB
User area: 58.24 GiB(62,537,072,640 bytes)
Factory Reset...
Creating filesystem... Done.
Writing cache... Done.
Creating filesystem... Done.
Writing userdata... Unknown chunk type 0x0000 at 0x00E0F0C4
Wrote 40095703 blocks, expected to write 13239547 blocks
Done.
Done.