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Martview MV-115 27in1 IP Middle Board Stencil Net Set

UFi Emmc RPMB Clean by Ufi box Post Success report Here

UFi Box & Dongle
sonu kh

sonu kh

Active Member
Nov 21, 2019
29
2
india

This is the health report of micron emmc, can it be repaired?​


Connection status: XHCI:HUB3[#5]:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8843-6062
Boot version: 1.05, FW version: 1.15 (Nov 8 2022 18:51:23)
Insertion test... Done
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 4MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x13 (Micron)
Product name: S0J9D8 (0x53304a394438), rev: 0x10, serial number: 0x05991CBF
Manufacturing date: Aug 2018
CID: 13014E53 304A3944 38100599 1CBF8576
CSD: D05F0132 8F5913FF FFFFFFEF 964000A8
Device version: 0x0001
Firmware version: 0x7
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4 MiB
Boot2: 4 MiB
RPMB: 4 MiB
User area: 58.24 GiB(62,537,072,640 bytes)

eMMC 5.x Health report:
Device lifetime: Normal
Estimation of the device lifetime (SLC): Exceeded its maximum estimated device life time
Estimation of the device lifetime (MLC): Exceeded its maximum estimated device life time
Micron eMMC Secure Smart Report:
Spare Block info
Total spare block count: 251
Used spare blocks: 0.24%
Bad Block info
Total initial bad block count: 61
Total later bad block count: 0
Erase Count info
MLC area erase count Min: 0 Max: 2 Ave: 0
SLC area erase count Min: 1 Max: 34465 Ave: 2
Sector Erase Count info
Total number of block erase count tables: 6
 
arhanmobile

arhanmobile

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Aug 16, 2019
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sonu kh said:

This is the health report of micron emmc, can it be repaired?​


Connection status: XHCI:HUB3[#5]:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8843-6062
Boot version: 1.05, FW version: 1.15 (Nov 8 2022 18:51:23)
Insertion test... Done
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 4MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x13 (Micron)
Product name: S0J9D8 (0x53304a394438), rev: 0x10, serial number: 0x05991CBF
Manufacturing date: Aug 2018
CID: 13014E53 304A3944 38100599 1CBF8576
CSD: D05F0132 8F5913FF FFFFFFEF 964000A8
Device version: 0x0001
Firmware version: 0x7
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4 MiB
Boot2: 4 MiB
RPMB: 4 MiB
User area: 58.24 GiB(62,537,072,640 bytes)

eMMC 5.x Health report:
Device lifetime: Normal
Estimation of the device lifetime (SLC): Exceeded its maximum estimated device life time
Estimation of the device lifetime (MLC): Exceeded its maximum estimated device life time
Micron eMMC Secure Smart Report:
Spare Block info
Total spare block count: 251
Used spare blocks: 0.24%
Bad Block info
Total initial bad block count: 61
Total later bad block count: 0
Erase Count info
MLC area erase count Min: 0 Max: 2 Ave: 0
SLC area erase count Min: 1 Max: 34465 Ave: 2
Sector Erase Count info
Total number of block erase count tables: 6
Click to expand...
No
 
faraday

faraday

Friend's Martview
Sep 24, 2020
166
36
İSTANBUL
The year is 2024. When was UFI last seen? It was seen in 2022. UFI tool and box are dead. The project is dead. Shame on those who deceive people. When will you wake up, lazy people?
 
OelAii Tech

OelAii Tech

Member
May 3, 2021
6
0
Indonesia
faraday said:
The year is 2024. When was UFI last seen? It was seen in 2022. UFI tool and box are dead. The project is dead. Shame on those who deceive people. When will you wake up, lazy people?
Click to expand...
When the death? do you go to the funeral? if there are other die please tell me
 
E

EServces2026

Junior Member
Aug 22, 2026
2
0
kolkata
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 4MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x9B (YMTC)
Product name: Y2P032 (0x593250303332), rev: 0x00, serial number: 0x939345FF
Manufacturing date: Apr 2022
CID: 9B010059 32503033 32009393 45FF4912
CSD: D04F0132 8F5903FF FFFFFFEF 8A40005C
Firmware version: 0xD0C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4 MiB
Boot2: 4 MiB
RPMB: 16 MiB [Provisioned, counter: 439]
User area: 29.12 GiB(31,268,536,320 bytes)
Cache size: 1 MiB
Hardware reset function: 1
Secure Write Protect Information: 0x01
Secure Feature support: 0x55
Partition configuration: 0x48
Boot acknowledge is sent during the boot operation
Boot partition 1 is enabled for boot
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x02
Bus width: x8 (sdr/ddr), boot mode: sdr(default), reset bus width to x1 sdr(default)
Boot area write protection: 0x00
eMMC selected: [YMTC] YMEC6A2TB1A2C3/32GB (BGA153)






health cheek report

Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 4MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x9B (YMTC)
Product name: Y2P032 (0x593250303332), rev: 0x00, serial number: 0x939345FF
Manufacturing date: Apr 2022
CID: 9B010059 32503033 32009393 45FF4912
CSD: D04F0132 8F5903FF FFFFFFEF 8A40005C
Firmware version: 0xD0C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4 MiB
Boot2: 4 MiB
RPMB: 16 MiB
User area: 29.12 GiB(31,268,536,320 bytes)

eMMC 5.x Health report:
Device lifetime: Normal
Estimation of the device lifetime (SLC): Exceeded its maximum estimated device life time
Estimation of the device lifetime (MLC): Exceeded its maximum estimated device life time
 
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