Connection status: XHCI:HUB3[#2]:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8842-8709
Boot version: 1.05, FW version: 1.14 (Aug 25 2021 04:56:05)
Insertion test... Done
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 4MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: GP6BAB (0x475036424142), rev: 0x05, serial number: 0xBD65E417
Manufacturing date: Jan 2021
CID: 15010047 50364241 4205BD65 E4171804
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
Firmware version: 0x05
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4 MiB
Boot2: 4 MiB
RPMB: 16 MiB
User area: 58.24 GiB(62,537,072,640 bytes)
Factory Reset...
failed
failed
failed
Interface: UFI High-Speed
Serial number: 0011-8842-8709
Boot version: 1.05, FW version: 1.14 (Aug 25 2021 04:56:05)
Insertion test... Done
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 4MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: GP6BAB (0x475036424142), rev: 0x05, serial number: 0xBD65E417
Manufacturing date: Jan 2021
CID: 15010047 50364241 4205BD65 E4171804
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
Firmware version: 0x05
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4 MiB
Boot2: 4 MiB
RPMB: 16 MiB
User area: 58.24 GiB(62,537,072,640 bytes)
Factory Reset...
failed
failed
failed