Connection status: EHCI:HUB:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8841-7415
Boot version: 1.05, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... Done
Init bus...
VCC: 3.3 V, VCCQ: 3.0 V
Bus: 4 bit (HS SDR 52MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: Q823MB (0x513832334d42), rev: 0x00, serial number: 0x2D38D3B6
Manufacturing date: Jul 2016
CID: 15010051 3832334D 42002D38 D3B67366
CSD: D0270132 0F5903FF F6DBFFEF 92404008
EXT_CSD revision: 1.7 (MMC v5.0, v5.01)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 14.56 GiB(15,634,268,160 bytes)
Cache size: 64 MiB
Hardware reset function: 1
Partition configuration: 0x48
Boot acknowledge is sent during the boot operation
Boot partition 1 is enabled for boot
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x00
Boot area write protection: 0x00
Power-on write protection: possible
Permanent write protection: possible
Lock status: not locked
ANDROID System Info:
platform: MT6737M, cpu abi: arm64-v8a
manufacturer: Intex
board: x6069_intex_aqua_s9_37m65, name: x6069_intex_37m65
brand: Intex, model: Cloud S9
build model list: Cloud S9
build id: MRA58K, version: 7.0 Nougat (Intex_Cloud_S9_V07_Indian)
build description: x6069_intex_37m65-user 6.0 MRA58K 1470541359 release-keys
Internal storage: 10.95 GiB
crypto state: unencrypted
EXT_CSD backup saved to "\\%BACKUPS%\Q823MB_2D38D3B6.ext_csd"
Selected: [SAMSUNG] moviNAND KMQ820013M-B419/16GB+LPDDR3 16Gb (BGA221)
Interface: UFI High-Speed
Serial number: 0011-8841-7415
Boot version: 1.05, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... Done
Init bus...
VCC: 3.3 V, VCCQ: 3.0 V
Bus: 4 bit (HS SDR 52MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: Q823MB (0x513832334d42), rev: 0x00, serial number: 0x2D38D3B6
Manufacturing date: Jul 2016
CID: 15010051 3832334D 42002D38 D3B67366
CSD: D0270132 0F5903FF F6DBFFEF 92404008
EXT_CSD revision: 1.7 (MMC v5.0, v5.01)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 14.56 GiB(15,634,268,160 bytes)
Cache size: 64 MiB
Hardware reset function: 1
Partition configuration: 0x48
Boot acknowledge is sent during the boot operation
Boot partition 1 is enabled for boot
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x00
Boot area write protection: 0x00
Power-on write protection: possible
Permanent write protection: possible
Lock status: not locked
ANDROID System Info:
platform: MT6737M, cpu abi: arm64-v8a
manufacturer: Intex
board: x6069_intex_aqua_s9_37m65, name: x6069_intex_37m65
brand: Intex, model: Cloud S9
build model list: Cloud S9
build id: MRA58K, version: 7.0 Nougat (Intex_Cloud_S9_V07_Indian)
build description: x6069_intex_37m65-user 6.0 MRA58K 1470541359 release-keys
Internal storage: 10.95 GiB
crypto state: unencrypted
EXT_CSD backup saved to "\\%BACKUPS%\Q823MB_2D38D3B6.ext_csd"
Selected: [SAMSUNG] moviNAND KMQ820013M-B419/16GB+LPDDR3 16Gb (BGA221)