Connection status: EHCI:HUB:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8841-7415
Boot version: 1.05, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... Done
Init bus...
VCC: 3.3 V, VCCQ: 3.0 V
Bus: 8 bit (HS SDR 24MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: RC14MB (0x524331344d42), rev: 0x07, serial number: 0xBAEBD613
Manufacturing date: Jun 2017
CID: 15010052 4331344D 4207BAEB D613645C
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 58.24 GiB(62,537,072,640 bytes)
Clear FRP Lock... Done
Interface: UFI High-Speed
Serial number: 0011-8841-7415
Boot version: 1.05, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... Done
Init bus...
VCC: 3.3 V, VCCQ: 3.0 V
Bus: 8 bit (HS SDR 24MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: RC14MB (0x524331344d42), rev: 0x07, serial number: 0xBAEBD613
Manufacturing date: Jun 2017
CID: 15010052 4331344D 4207BAEB D613645C
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 58.24 GiB(62,537,072,640 bytes)
Clear FRP Lock... Done