Is there any problem blank check,
***
Connection status: EHCI:HUB:HUB:USB 2.0 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8840-6369
Boot version: 1.04, FW version: 1.12 (Jun 7 2018 00:06:47)
Insertion test... Done.
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 4MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x90 (SK Hynix)
Product name: H8G2d (0x483847326404), rev: 0x05, serial number: 0x01A21D55
Manufacturing date: Jun 2015
CID: 90014A48 38473264 040501A2 1D55621C
CSD: D0270132 0F5903FF FFFFFFEF 8A4040D2
EXT_CSD revision: 1.6 (MMC v4.5, v4.51)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 7.28 GiB(7,818,182,656 bytes)
Current partition access:
Access to boot partition 1
Blank checking boot1 (8192 sectors)... non-blank at 0x00000000: data [ 45 4d 4d 43 ]
Current partition access:
Access to boot partition 2
Blank checking boot2 (8192 sectors)... Done in 8.584 s, content is blank
Current partition access:
Access to user area
Blank checking userarea (15269888 sectors)... non-blank at 0x000001C0: data [ 00 00 05 00 ]
And it is information
***
Connection status: EHCI:HUB:HUB:USB 2.0 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8840-6369
Boot version: 1.04, FW version: 1.12 (Jun 7 2018 00:06:47)
Insertion test... Done.
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 4MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x90 (SK Hynix)
Product name: H8G2d (0x483847326404), rev: 0x05, serial number: 0x01A21D55
Manufacturing date: Jun 2015
CID: 90014A48 38473264 040501A2 1D55621C
CSD: D0270132 0F5903FF FFFFFFEF 8A4040D2
EXT_CSD revision: 1.6 (MMC v4.5, v4.51)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 7.28 GiB(7,818,182,656 bytes)
Cache size: 512 KiB
Hardware reset function: 1
Partition configuration: 0x48
Boot acknowledge is sent during the boot operation
Boot partition 1 is enabled for boot
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x00
Boot area write protection: 0x00
Power-on write protection: possible
Permanent write protection: possible
Lock status: not locked
ANDROID System Info:
platform: MT6582, cpu abi: armeabi-v7a
manufacturer: Micromax
board: Q355, name: Q355
brand: Micromax, model: Micromax Q355
build id: LRX21M, version: 5.0 Lollipop (ALPS.L0.MP2.V1_TINNO6582.WT.L_P18)
build description: full_s5301-user 5.0 LRX21M 1426242326 release-keys
Selected: [HYNIX] eNAND H9TQ65A8GTMCUR-KTM/8GB+LPDDR3 8Gb (BGA221)
***
Connection status: EHCI:HUB:HUB:USB 2.0 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8840-6369
Boot version: 1.04, FW version: 1.12 (Jun 7 2018 00:06:47)
Insertion test... Done.
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 4MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x90 (SK Hynix)
Product name: H8G2d (0x483847326404), rev: 0x05, serial number: 0x01A21D55
Manufacturing date: Jun 2015
CID: 90014A48 38473264 040501A2 1D55621C
CSD: D0270132 0F5903FF FFFFFFEF 8A4040D2
EXT_CSD revision: 1.6 (MMC v4.5, v4.51)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 7.28 GiB(7,818,182,656 bytes)
Current partition access:
Access to boot partition 1
Blank checking boot1 (8192 sectors)... non-blank at 0x00000000: data [ 45 4d 4d 43 ]
Current partition access:
Access to boot partition 2
Blank checking boot2 (8192 sectors)... Done in 8.584 s, content is blank
Current partition access:
Access to user area
Blank checking userarea (15269888 sectors)... non-blank at 0x000001C0: data [ 00 00 05 00 ]
And it is information
***
Connection status: EHCI:HUB:HUB:USB 2.0 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8840-6369
Boot version: 1.04, FW version: 1.12 (Jun 7 2018 00:06:47)
Insertion test... Done.
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 4MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x90 (SK Hynix)
Product name: H8G2d (0x483847326404), rev: 0x05, serial number: 0x01A21D55
Manufacturing date: Jun 2015
CID: 90014A48 38473264 040501A2 1D55621C
CSD: D0270132 0F5903FF FFFFFFEF 8A4040D2
EXT_CSD revision: 1.6 (MMC v4.5, v4.51)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 7.28 GiB(7,818,182,656 bytes)
Cache size: 512 KiB
Hardware reset function: 1
Partition configuration: 0x48
Boot acknowledge is sent during the boot operation
Boot partition 1 is enabled for boot
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x00
Boot area write protection: 0x00
Power-on write protection: possible
Permanent write protection: possible
Lock status: not locked
ANDROID System Info:
platform: MT6582, cpu abi: armeabi-v7a
manufacturer: Micromax
board: Q355, name: Q355
brand: Micromax, model: Micromax Q355
build id: LRX21M, version: 5.0 Lollipop (ALPS.L0.MP2.V1_TINNO6582.WT.L_P18)
build description: full_s5301-user 5.0 LRX21M 1426242326 release-keys
Selected: [HYNIX] eNAND H9TQ65A8GTMCUR-KTM/8GB+LPDDR3 8Gb (BGA221)