- Aug 16, 2019
- 19
- 6
Read Info
Factory Reset-
Clear FRP-
Connection status: XHCI:HUB3:HUB3:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8841-2410
Boot version: 1.04, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... Done.
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 4MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: QD63MB (0x514436334d42), rev: 0x03, serial number: 0xCABDC668
Manufacturing date: Dec 2018
CID: 15010051 4436334D 4203CABD C668C5BC
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 16384 KiB
User area: 29.12 GiB(31,268,536,320 bytes)
Cache size: 64 MiB
Hardware reset function: 1
Partition configuration: 0x38
No boot acknowledge is sent (default)
User area is enabled for boot
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x00
Boot area write protection: 0x00
Power-on write protection: possible
Permanent write protection: possible
Lock status: not locked
ANDROID System Info:
platform: msm8953, cpu abi: arm64-v8a
manufacturer: OPPO
board: msm8953, name: RMX1805
brand: OPPO, model: RMX1805 (realme 2)
build model list: RMX1809 (realme 2), RMX1811 (realme C1), RMX1805 (realme 2)
build id: PKQ1.190319.001, version: 9 Pie (RMX1805EX_11_A.56)
build description: S88051AA1-user 9 PKQ1.190319.001 eng.root.20190719.220749 release-keys
crypto state: encrypted?
Custom moviNAND command is not supported for this device(MMC51).
Detected: SAMSUNG moviNAND KMQD60003M-BXXX/32G
Connection status: XHCI:HUB3:HUB3:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8841-2410
Boot version: 1.04, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... Done.
VCCQ not properly connected
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 4MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: QD63MB (0x514436334d42), rev: 0x03, serial number: 0xCABDC668
Manufacturing date: Dec 2018
CID: 15010051 4436334D 4203CABD C668C5BC
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 16384 KiB
User area: 29.12 GiB(31,268,536,320 bytes)
Reading extcsd, size: 512 bytes...
File saved to "\\%BACKUPS%\OPPO\RMX1805(RMX1805EX_11_A.56-9-PKQ1.190319.001)[QD63MB_CABDC668]\ext_csd.bin" (CRC32: 0x7227CF5F)
Current partition access:
Access to boot partition 1
Reading boot1, size: 4 MiB... Done in 8.618 s
File saved to "\\%BACKUPS%\OPPO\RMX1805(RMX1805EX_11_A.56-9-PKQ1.190319.001)[QD63MB_CABDC668]\boot1.bin" (CRC32: 0x1147406A)
Blank checking: NOT blank
Current partition access:
Access to boot partition 2
Reading boot2, size: 4 MiB... Done in 8.614 s
File saved to "\\%BACKUPS%\OPPO\RMX1805(RMX1805EX_11_A.56-9-PKQ1.190319.001)[QD63MB_CABDC668]\boot2.bin" (CRC32: 0x45EF9BC2)
Factory Reset-
Connection status: XHCI:HUB3:HUB3:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8841-2410
Boot version: 1.04, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... Done.
VCCQ not properly connected
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 4MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: QD63MB (0x514436334d42), rev: 0x03, serial number: 0xCABDC668
Manufacturing date: Dec 2018
CID: 15010051 4436334D 4203CABD C668C5BC
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 16384 KiB
User area: 29.12 GiB(31,268,536,320 bytes)
Factory Reset...
Creating filesystem with parameters:
Size: 268435456
Block size: 4096
Blocks per group: 32768
Inodes per group: 8192
Inode size: 256
Journal blocks: 1024
Label:
Blocks: 65536
Block groups: 2
Reserved block group size: 15
Created filesystem with 13/16384 inodes and 2091/65536 blocks
Writing cache... Done.
Creating filesystem with parameters:
Size: 25438433280
Block size: 4096
Blocks per group: 32768
Inodes per group: 8176
Inode size: 256
Journal blocks: 32768
Label:
Blocks: 6210555
Block groups: 190
Reserved block group size: 1024
Created filesystem with 11/1553440 inodes and 141538/6210555 blocks
Writing userdata... Done.
Done.
Clear FRP-
Connection status: XHCI:HUB3:HUB3:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8841-2410
Boot version: 1.04, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... Done.
VCCQ not properly connected
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 4MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: QD63MB (0x514436334d42), rev: 0x03, serial number: 0xCABDC668
Manufacturing date: Dec 2018
CID: 15010051 4436334D 4203CABD C668C5BC
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 16384 KiB
User area: 29.12 GiB(31,268,536,320 bytes)
Factory Reset...
Creating filesystem with parameters:
Size: 268435456
Block size: 4096
Blocks per group: 32768
Inodes per group: 8192
Inode size: 256
Journal blocks: 1024
Label:
Blocks: 65536
Block groups: 2
Reserved block group size: 15
Created filesystem with 13/16384 inodes and 2091/65536 blocks
Writing cache... Done.
Creating filesystem with parameters:
Size: 25438433280
Block size: 4096
Blocks per group: 32768
Inodes per group: 8176
Inode size: 256
Journal blocks: 32768
Label:
Blocks: 6210555
Block groups: 190
Reserved block group size: 1024
Created filesystem with 11/1553440 inodes and 141538/6210555 blocks
Writing userdata... Done.
Done.
