Connection status: EHCI:HUB:USB 2.0 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8839-8250
Boot version: 1.04, FW version: 1.12 (Jun 7 2018 00:06:47)
Insertion test... Done.
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 4MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: QD63MB (0x514436334d42), rev: 0x03, serial number: 0xED4EC69B
Manufacturing date: Jan 2019
CID: 15010051 4436334D 4203ED4E C69B1670
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 16384 KiB
User area: 29.12 GiB(31,268,536,320 bytes)
Factory Reset...
Creating filesystem... Done.
Writing cache... Done.
Creating filesystem... Done.
Writing userdata... Unknown chunk type 0x0000 at 0x00E0A0C4
Wrote 20080113 blocks, expected to write 5802235 blocks
Done.
Done.
Interface: UFI High-Speed
Serial number: 0011-8839-8250
Boot version: 1.04, FW version: 1.12 (Jun 7 2018 00:06:47)
Insertion test... Done.
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 4MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: QD63MB (0x514436334d42), rev: 0x03, serial number: 0xED4EC69B
Manufacturing date: Jan 2019
CID: 15010051 4436334D 4203ED4E C69B1670
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 16384 KiB
User area: 29.12 GiB(31,268,536,320 bytes)
Factory Reset...
Creating filesystem... Done.
Writing cache... Done.
Creating filesystem... Done.
Writing userdata... Unknown chunk type 0x0000 at 0x00E0A0C4
Wrote 20080113 blocks, expected to write 5802235 blocks
Done.
Done.