UFi Tecno kc3 Emmc Damaged Change and repair with ufi....

UFi Box & Dongle

mintushakya

Active Member
Aug 16, 2019
17
5
EMMC CHANGE TO 3GB 32GB(SAMSUNG) FROM 4GB 64GB(SKHYNIX)

Connection status: XHCI:HUB3:[#0]:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8841-2410
Boot version: 1.04, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... [No eMMC connected] Aborted
Connection status: XHCI:HUB3:[#0]:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8841-2410
Boot version: 1.04, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... Done
Init bus...
VCC: 3.3 V, VCCQ: 3.0 V
Bus: 8 bit (HS SDR 52MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: GD6BMB (0x474436424d42), rev: 0x01, serial number: 0xCBA25C59
Manufacturing date: Jun 2018
CID: 15010047 4436424D 4201CBA2 5C5965FC
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4 MiB
Boot2: 4 MiB
RPMB: 4 MiB [Authentication Key not yet programmed]
User area: 29.12 GiB(31,268,536,320 bytes)
Cache size: 64 MiB
Hardware reset function: 1
Partition configuration: 0x48
Boot acknowledge is sent during the boot operation
Boot partition 1 is enabled for boot
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x00
Boot area write protection: 0x00
eMMC selected: [SAMSUNG] KMGD6001BM-B421/32GB (BGA221)
platform: MT6765
project: kc3_h627mt62
storage: EMMC
boot_channel: MSDC_0
block_size: 0x00020000
MTK Preloader file info:
Found 8 supported ids:
EMMC [SK Hynix] hB8aP 90014A68 42386150 3Exxxxxx xxxxxxxx
EMMC [SK Hynix] HCG8a4 90014A48 43473861 34xxxxxx xxxxxxxx
EMMC [Samsung] GD6BMB 15010047 4436424D 42xxxxxx xxxxxxxx
EMMC [Samsung] RH64AB 15010052 48363441 42xxxxxx xxxxxxxx
EMMC [SK Hynix] HBG4a2 90014A48 42473461 32xxxxxx xxxxxxxx
EMMC [Samsung] RX64MB 15010052 5836344D 42xxxxxx xxxxxxxx
EMMC [SK Hynix] hC9aP3 90014A68 43396150 33xxxxxx xxxxxxxx
EMMC [Samsung] RP64MB 15010052 5036344D 42xxxxxx xxxxxxxx
Connection status: XHCI:HUB3:[#0]:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8841-2410
Boot version: 1.04, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... Done
Init bus...
VCC: 3.3 V, VCCQ: 3.0 V
Bus: 8 bit (HS SDR 24MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: GD6BMB (0x474436424d42), rev: 0x01, serial number: 0xCBA25C59
Manufacturing date: Jun 2018
CID: 15010047 4436424D 4201CBA2 5C5965FC
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4 MiB
Boot2: 4 MiB
RPMB: 4 MiB
User area: 29.12 GiB(31,268,536,320 bytes)
Re-partitioning... Done
Writing MBR, GPT at 0x00000000-0x000043FF (34 sectors)... Done in 0.012 s
Current partition access:
Access to boot partition 1
Writing preloader at 0x00000000 (478 sectors)... Done in 0.031 s
Setting boot partition config to 0x48... Done
Current partition access:
Access to user area
Processing file: "md1img.img"... Writing md1img at 0x01200000 (101034 sectors)... Done in 4.941 s
Processing file: "spmfw.img"... Writing spmfw at 0x07600000 (95 sectors)... Done in 0.010 s
Processing file: "scp.img"... Writing scp1 at 0x07700000 (1055 sectors)... Done in 0.065 s
Processing file: "scp.img"... Writing scp2 at 0x07800000 (1055 sectors)... Done in 0.043 s
Processing file: "sspm.img"... Writing sspm_1 at 0x07900000 (838 sectors)... Done in 0.037 s
Processing file: "sspm.img"... Writing sspm_2 at 0x07A00000 (838 sectors)... Done in 0.037 s
Processing file: "lk.img"... Writing lk at 0x0DB00000 (1452 sectors)... Done in 0.076 s
Processing file: "lk.img"... Writing lk2 at 0x0DC00000 (1452 sectors)... Done in 0.062 s
Processing file: "boot.img"... Writing boot at 0x0DD00000 (65536 sectors)... Done in 2.851 s
Processing file: "logo.bin"... Writing logo at 0x0FD00000 (2868 sectors)... Done in 0.125 s
Processing file: "dtbo.img"... Writing dtbo at 0x10500000 (16384 sectors)... Done in 0.704 s
Processing file: "tee.img"... Writing tee1 at 0x10D00000 (4391 sectors)... Done in 0.189 s
Processing file: "tee.img"... Writing tee2 at 0x11200000 (4391 sectors)... Done in 0.183 s
Processing file: "vendor.img"... Writing sparse image vendor at 0x11800000 (1048576 sectors)... Done in 36.501 s
Processing file: "system.img"... Writing sparse image system at 0x31800000 (7372800 sectors)... Done in 5 mins 6.330 s
Processing file: "vbmeta.img"... Writing vbmeta at 0x112800000 (8 sectors)... Done in 0.001 s
Processing file: "cache.img"... Writing sparse image cache at 0x117000000 (614400 sectors)... Done in 0.015 s
Processing file: "recovery.img"... Writing recovery at 0x129C00000 (65536 sectors)... Done in 3.060 s
Processing file: "tkv.img"... Writing tkv at 0x12BC00000 (2048 sectors)... Done in 0.090 s
Processing file: "tranfs.img"... Writing sparse image tranfs at 0x12F680000 (614400 sectors)... Done in 0.016 s
Processing file: "userdata.img"... Writing sparse image userdata at 0x148800000 (6291456 sectors)... Done in 0.027 s
Setting boot partition config to 0x48... Done


 
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aftab_ansari5287

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Aug 16, 2019
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EMMC CHANGE TO 3GB 32GB(SAMSUNG) FROM 4GB 64GB(SKHYNIX)

Connection status: XHCI:HUB3:[#0]:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8841-2410
Boot version: 1.04, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... [No eMMC connected] Aborted
Connection status: XHCI:HUB3:[#0]:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8841-2410
Boot version: 1.04, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... Done
Init bus...
VCC: 3.3 V, VCCQ: 3.0 V
Bus: 8 bit (HS SDR 52MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: GD6BMB (0x474436424d42), rev: 0x01, serial number: 0xCBA25C59
Manufacturing date: Jun 2018
CID: 15010047 4436424D 4201CBA2 5C5965FC
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4 MiB
Boot2: 4 MiB
RPMB: 4 MiB [Authentication Key not yet programmed]
User area: 29.12 GiB(31,268,536,320 bytes)
Cache size: 64 MiB
Hardware reset function: 1
Partition configuration: 0x48
Boot acknowledge is sent during the boot operation
Boot partition 1 is enabled for boot
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x00
Boot area write protection: 0x00
eMMC selected: [SAMSUNG] KMGD6001BM-B421/32GB (BGA221)
platform: MT6765
project: kc3_h627mt62
storage: EMMC
boot_channel: MSDC_0
block_size: 0x00020000
MTK Preloader file info:
Found 8 supported ids:
EMMC [SK Hynix] hB8aP 90014A68 42386150 3Exxxxxx xxxxxxxx
EMMC [SK Hynix] HCG8a4 90014A48 43473861 34xxxxxx xxxxxxxx
EMMC [Samsung] GD6BMB 15010047 4436424D 42xxxxxx xxxxxxxx
EMMC [Samsung] RH64AB 15010052 48363441 42xxxxxx xxxxxxxx
EMMC [SK Hynix] HBG4a2 90014A48 42473461 32xxxxxx xxxxxxxx
EMMC [Samsung] RX64MB 15010052 5836344D 42xxxxxx xxxxxxxx
EMMC [SK Hynix] hC9aP3 90014A68 43396150 33xxxxxx xxxxxxxx
EMMC [Samsung] RP64MB 15010052 5036344D 42xxxxxx xxxxxxxx
Connection status: XHCI:HUB3:[#0]:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8841-2410
Boot version: 1.04, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... Done
Init bus...
VCC: 3.3 V, VCCQ: 3.0 V
Bus: 8 bit (HS SDR 24MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: GD6BMB (0x474436424d42), rev: 0x01, serial number: 0xCBA25C59
Manufacturing date: Jun 2018
CID: 15010047 4436424D 4201CBA2 5C5965FC
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4 MiB
Boot2: 4 MiB
RPMB: 4 MiB
User area: 29.12 GiB(31,268,536,320 bytes)
Re-partitioning... Done
Writing MBR, GPT at 0x00000000-0x000043FF (34 sectors)... Done in 0.012 s
Current partition access:
Access to boot partition 1
Writing preloader at 0x00000000 (478 sectors)... Done in 0.031 s
Setting boot partition config to 0x48... Done
Current partition access:
Access to user area
Processing file: "md1img.img"... Writing md1img at 0x01200000 (101034 sectors)... Done in 4.941 s
Processing file: "spmfw.img"... Writing spmfw at 0x07600000 (95 sectors)... Done in 0.010 s
Processing file: "scp.img"... Writing scp1 at 0x07700000 (1055 sectors)... Done in 0.065 s
Processing file: "scp.img"... Writing scp2 at 0x07800000 (1055 sectors)... Done in 0.043 s
Processing file: "sspm.img"... Writing sspm_1 at 0x07900000 (838 sectors)... Done in 0.037 s
Processing file: "sspm.img"... Writing sspm_2 at 0x07A00000 (838 sectors)... Done in 0.037 s
Processing file: "lk.img"... Writing lk at 0x0DB00000 (1452 sectors)... Done in 0.076 s
Processing file: "lk.img"... Writing lk2 at 0x0DC00000 (1452 sectors)... Done in 0.062 s
Processing file: "boot.img"... Writing boot at 0x0DD00000 (65536 sectors)... Done in 2.851 s
Processing file: "logo.bin"... Writing logo at 0x0FD00000 (2868 sectors)... Done in 0.125 s
Processing file: "dtbo.img"... Writing dtbo at 0x10500000 (16384 sectors)... Done in 0.704 s
Processing file: "tee.img"... Writing tee1 at 0x10D00000 (4391 sectors)... Done in 0.189 s
Processing file: "tee.img"... Writing tee2 at 0x11200000 (4391 sectors)... Done in 0.183 s
Processing file: "vendor.img"... Writing sparse image vendor at 0x11800000 (1048576 sectors)... Done in 36.501 s
Processing file: "system.img"... Writing sparse image system at 0x31800000 (7372800 sectors)... Done in 5 mins 6.330 s
Processing file: "vbmeta.img"... Writing vbmeta at 0x112800000 (8 sectors)... Done in 0.001 s
Processing file: "cache.img"... Writing sparse image cache at 0x117000000 (614400 sectors)... Done in 0.015 s
Processing file: "recovery.img"... Writing recovery at 0x129C00000 (65536 sectors)... Done in 3.060 s
Processing file: "tkv.img"... Writing tkv at 0x12BC00000 (2048 sectors)... Done in 0.090 s
Processing file: "tranfs.img"... Writing sparse image tranfs at 0x12F680000 (614400 sectors)... Done in 0.016 s
Processing file: "userdata.img"... Writing sparse image userdata at 0x148800000 (6291456 sectors)... Done in 0.027 s
Setting boot partition config to 0x48... Done


If you have this model dump post here
 
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