- Oct 25, 2018
- 131
- 136
Xiaomi Redmi 6(cereus)Dead/EMMC Change/reprogramming Done By UFIBOX EMMC Tool
Dead MICRON EMMC Changed To [Samsung] QE63MB
Write Firmware By vendor:
EMMC INFO:
Regards.
Dead MICRON EMMC Changed To [Samsung] QE63MB
Write Firmware By vendor:
Connection status: XHCI:HUB3:HUB3:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8841-3514
Boot version: 1.05, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... Done
Init bus...
VCC: 3.3 V, VCCQ: 3.0 V
Bus: 8 bit (HS SDR 24MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: QE63MB (0x514536334d42), rev: 0x03, serial number: 0x1C5DD28C
Manufacturing date: Feb 2018
CID: 15010051 4536334D 42031C5D D28C254E
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 14.56 GiB(15,634,268,160 bytes)
Writing preloader header... Done
Current partition access:
Access to boot partition 1
Writing preloader at 0x00000000 (463 sectors)... Done in 0.027 s
Writing boot partition config to 0x48... Done
Processing file: "recovery.img"... Writing recovery at 0x00108000 (131072 sectors)... Done in 9.134 s
Processing file: "md1img.img"... Writing md1img at 0x13580000 (110877 sectors)... Done in 5.106 s
Processing file: "spmfw.img"... Writing spmfw at 0x19980000 (102 sectors)... Done in 0.004 s
Processing file: "scp.img"... Writing scp1 at 0x19A80000 (1103 sectors)... Done in 0.050 s
Processing file: "scp.img"... Writing scp2 at 0x19B80000 (1103 sectors)... Done in 0.052 s
Processing file: "sspm.img"... Writing sspm_1 at 0x19C80000 (846 sectors)... Done in 0.042 s
Processing file: "sspm.img"... Writing sspm_2 at 0x19D80000 (846 sectors)... Done in 0.039 s
Processing file: "vbmeta.img"... Writing vbmeta at 0x1FE80000 (8 sectors)... Done in 0.001 s
Processing file: "lk.img"... Writing lk at 0x20680000 (1364 sectors)... Done in 0.061 s
Processing file: "lk.img"... Writing lk2 at 0x20780000 (1364 sectors)... Done in 0.062 s
Processing file: "boot.img"... Writing boot at 0x20880000 (131072 sectors)... Done in 6.070 s
Processing file: "logo.bin"... Writing logo at 0x24880000 (2296 sectors)... Done in 0.104 s
Processing file: "odmdtbo.img"... Writing odmdtbo at 0x28880000 (32768 sectors)... Done in 1.529 s
Processing file: "cust.img"... Writing sparse image cust at 0x29880000 (1048576 sectors)... Done in 37.492 s
Processing file: "tee.img"... Writing tee1 at 0x49880000 (6630 sectors)... Done in 0.305 s
Processing file: "tee.img"... Writing tee2 at 0x49D80000 (6630 sectors)... Done in 0.318 s
Processing file: "vendor.img"... Writing sparse image vendor at 0x4A800000 (1572864 sectors)... Done in 32.811 s
Processing file: "system.img"... Writing sparse image system at 0x7A800000 (5242880 sectors)... Done in 4 mins 3.692 s
Processing file: "cache.img"... Writing sparse image cache at 0x11B000000 (524288 sectors)... Done in 0.017 s
Processing file: "userdata.img"... Writing sparse image userdata at 0x12B000000 (6291456 sectors)... Done in 19.032 s
Writing boot partition config to 0x48... Done
EMMC INFO:
Connection status: XHCI:HUB3:HUB3:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8841-3514
Boot version: 1.05, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... Done
Init bus...
VCC: 3.3 V, VCCQ: 3.0 V
Bus: 8 bit (HS SDR 52MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: QE63MB (0x514536334d42), rev: 0x03, serial number: 0x1C5DD28C
Manufacturing date: Feb 2018
CID: 15010051 4536334D 42031C5D D28C254E
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 14.56 GiB(15,634,268,160 bytes)
Cache size: 64 MiB
Hardware reset function: 1
Partition configuration: 0x48
Boot acknowledge is sent during the boot operation
Boot partition 1 is enabled for boot
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x00
Boot area write protection: 0x00
Power-on write protection: possible
Permanent write protection: possible
Lock status: not locked
ANDROID System Info:
platform: MT6765, cpu abi: armeabi-v7a
manufacturer: Xiaomi
board: cereus, name: cereus
brand: xiaomi, model: Redmi 6
build model list: Redmi 6
build id: PPR1.180610.011, version: 8.1.0 Oreo (SW_S98507AE1_V009_M13_XM_C3D_USR)
build description: cereus-user 9 PPR1.180610.011 V11.0.1.0.PCGMIXM release-keys
Internal storage: 3 GiB
crypto state: unencrypted
Custom moviNAND command is not supported for this device(MMC51).
Selected: [SAMSUNG] KMQE60013M-B318/16GB+LPDDR3 16Gb (BGA221)
Regards.