Post Success Reports Here Successfully Repaired/Dead Recovered Handset By Ufi Box

ferouzkassim

Active Member
Oct 11, 2018
50
34
Uganda
Skype
ferouz_kassim
oppo A31 CPH2015
PASSWORD REMOVE DONE

Connection status: XHCI:HUB3:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8840-4224
Boot version: 1.04, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... Done
VCCQ not properly connected
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 4MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: DH6DAB (0x444836444142), rev: 0x02, serial number: 0x85C46AE4
Manufacturing date: Mar 2020
CID: 15010044 48364441 420285C4 6AE43768
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 16384 KiB
User area: 58.24 GiB(62,537,072,640 bytes)
Cache size: 64 MiB
Hardware reset function: 1
Partition configuration: 0x48
Boot acknowledge is sent during the boot operation
Boot partition 1 is enabled for boot
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x02
Bus width: x8 (sdr/ddr), boot mode: sdr(default), reset bus width to x1 sdr(default)
Boot area write protection: 0x00
Power-on write protection: possible
Permanent write protection: possible
Lock status: not locked

ANDROID System Info:
platform: MT6765, cpu abi: arm64-v8a
manufacturer: OPPO
board: oppo6765_19581, name: CPH2015
brand: OPPO, model: CPH2015 (OPPO A31)
build model list: CPH2015 (OPPO A31)
build id: PPR1.180610.011, version: 9 Pie (CPH2015EX_11_A.37)
build description: full_oppo6765_19581-user 9 PPR1.180610.011 eng.root.20200716.095015 release-keys

crypto state: encrypted?
crypto state: encrypted?
EXT_CSD backup saved to "\\%BACKUPS%\DH6DAB_85C46AE4.ext_csd"
Custom moviNAND command is not supported for this device(MMC51).
Detected: SAMSUNG moviNAND KMDH6000DA-BXXX/64G






Connection status: XHCI:HUB3:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8840-4224
Boot version: 1.04, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... Done
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 4MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: DH6DAB (0x444836444142), rev: 0x02, serial number: 0x85C46AE4
Manufacturing date: Mar 2020
CID: 15010044 48364441 420285C4 6AE43768
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 16384 KiB
User area: 58.24 GiB(62,537,072,640 bytes)

MasterClear [1]... Done
 

Forum Supporter

Friend's Martview
Jan 31, 2017
3,291
6,752
Martview
XIAOMI REDMI 4X HANG ON LOGO SOLVED BY UFI BOX

READ INFO

FLASHING

REMOVE MI AC LOCK

FRP RESET



 

Rak_1790

Junior Member
Jun 12, 2020
2
0
India
I can't flash any mi phone like mi 6a
Mi6 mtk cpu or Qualcomm cpu wich one how to use credit any time say upgrade your system memory low like that what is pro say any think my pc ram is 4gb
 

jaanjaan

Active Member
Aug 26, 2017
88
38
punjab
Skype
[email protected]
Sucessfully Repaired Phone/Emmc Reprogramming By ufi BOx

QMOBILE Z8 DEAD RECOVER BY UFI DIRECT EMMC​

Qmobile z8 dead boot recover don by ufi direct emmc

and flash direct ufi box with emmc adaptor and read

dump file and uniqe file soo finly qmobile z8 alive

one again dump file shair my all ufi users for free.
QMOBILE Z8 DEAD RECOVER BY UFI DIRECT EMMC
 
Last edited by a moderator:

farhanab

Active Member
Sep 28, 2019
56
27
Alipur
Nokia plus alive only mtk port show\


BROM version[1]: 7.2021.1.0
DA: ANT-0-0020-0000-MTK_AllInOne_DA.bin
hash: 3f70ec0fa46960a390caa58014044f633694d3e0, size: 359.68 KiB
version: 3.3001.Fri.06:412019/07/26 21:21:17, start addr: 0x40000800
Connecting to BootROM...
Power off the phone, disconnect and reconnect the battery(if possible) and connect USB cable...
Hold the VOL UP + DOWN to force MediaTek BootROM.
Scanning BootROM or Preloader port... Done
Detected [BootROM] MediaTek USB Port_V1632 (COM30)
Connection status: EHCI:HUB:HUB:USB 1.10 High-Speed
USB Driver: [MediaTek Inc.] wdm_usb, version: 3.0.1504.0, date: 1-22-2015
Connecting Bootrom...
Sending Download Agent...
Platform: MT6739, Hw ver: 0xCB00, Sw ver: 0x0002
Secure ver: 0x00, BL ver: 0x00
SRAM size: 256 KiB
DRAM size: 1 GiB
SOC ID: 84ecd8c564385d0a7a7da6df924d78ea6e1ff1d809d6aebc81aca46d3da9f7e5
ME ID: 329a3322bdd19ea82e1c9f0a51b1bc68
Storage type: eMMC
Card/BGA: BGA (Discrete embedded)
Manufacturer ID: 0x15 (Samsung)
Product name: FN62MB (0x464e36324d42), rev: 0x03, serial number: 0x0300A83E
Manufacturing date: Mar 2019
CID: 15010046 4E36324D 42030300 A83E366F
Capacity: 7.29 GiB(7,827,095,552 bytes)
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 512 KiB (key exist)
User area: 7.28 GiB(7,818,182,656 bytes)
USB speed: High-Speed

Verifying Soc: passed
Verifying Storage ID: passed
Writing preloader: ANT-0-0630-00WW-1-1-preloader_ANT.bin, size: 117.77 KiB
Writing recovery: ANT-0-0630-00WW-1-1-recovery.img, size: 13.64 MiB
Writing systeminfo: fver, size: 10.27 KiB
Writing sutinfo: ANT-00WW-001-sutinfo.img, size: 55 bytes
Writing cda: ANT-00WW-006-cda.img, size: 6 MiB
Writing md1img: ANT-0-0630-00WW-1-1-md1img.img, size: 17.59 MiB
Writing md1dsp: ANT-0-0630-00WW-1-1-md1dsp.img, size: 6.11 MiB
Writing spmfw: ANT-0-0630-00WW-1-1-spmfw.img, size: 27.80 KiB
Writing mcupmfw: ANT-0-0630-00WW-1-1-mcupmfw.img, size: 6.97 KiB
Writing lk: ANT-0-0630-00WW-1-1-lk.img, size: 705.66 KiB
Writing lk2: ANT-0-0630-00WW-1-1-lk.img, size: 705.66 KiB
Writing loader_ext1: ANT-0-0630-00WW-1-1-loader_ext.img, size: 53.73 KiB
Writing loader_ext2: ANT-0-0630-00WW-1-1-loader_ext.img, size: 53.73 KiB
Writing boot: ANT-0-0630-00WW-1-1-boot.img, size: 7.76 MiB
Writing logo: ANT-0-0630-00WW-1-1-logo.bin, size: 167.17 KiB
Writing dtbo: ANT-0-0630-00WW-1-1-dtbo.img, size: 34.72 KiB
Writing tee1: ANT-0-0630-00WW-1-1-tee.img, size: 470.22 KiB
Writing tee2: ANT-0-0630-00WW-1-1-tee.img, size: 470.22 KiB
Writing vendor: ANT-0-0630-00WW-1-1-vendor.img, size: 210.34 MiB
Writing system: ANT-0-0630-00WW-1-1-system.img, size: 1.39 GiB
Writing cache: ANT-0-0630-00WW-1-1-cache.img, size: 80.10 KiB
Writing userdata: ANT-0-0630-00WW-1-1-userdata.img, size: 164.29 KiB

Completed in 1 min 27.195 s

 
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akram

Member
Nov 27, 2016
12
0
hydedrabad
OPPO F7,A7,A1K PATTERN AND FRP DONE
OPPO CPH 1819 PATTERN DONE

Connection status: EHCI:HUB:HUB:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8841-0169
Boot version: 1.04, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... Done
VCCQ not properly connected
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 4MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: DH6DMB (0x444836444d42), rev: 0x05, serial number: 0xB8066A03
Manufacturing date: Oct 2017
CID: 15010044 4836444D 4205B806 6A03A46C
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 58.24 GiB(62,537,072,640 bytes)
[Oppo] MasterClear [1]... Done
Connection status: EHCI:HUB:HUB:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8841-0169
Boot version: 1.04, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... Done
VCCQ not properly connected
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 4MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: DH6DMB (0x444836444d42), rev: 0x05, serial number: 0xB8066A03
Manufacturing date: Oct 2017
CID: 15010044 4836444D 4205B806 6A03A46C
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 58.24 GiB(62,537,072,640 bytes)
[Oppo] MasterClear [5]... Done
Connection status: EHCI:HUB:HUB:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8841-0169
Boot version: 1.04, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... Done
VCCQ not properly connected
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 4MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: DH6DMB (0x444836444d42), rev: 0x05, serial number: 0xB8066A03
Manufacturing date: Oct 2017
CID: 15010044 4836444D 4205B806 6A03A46C
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 58.24 GiB(62,537,072,640 bytes)
Clear FRP Lock... Done
Connection status: EHCI:HUB:HUB:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8841-0169
Boot version: 1.04, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... Done
VCCQ not properly connected
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 4MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: DH6DMB (0x444836444d42), rev: 0x05, serial number: 0xB8066A03
Manufacturing date: Oct 2017
CID: 15010044 4836444D 4205B806 6A03A46C
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 58.24 GiB(62,537,072,640 bytes)
Reading cache at 0x19A800000-0x1B57FFFFF size: 432 MiB... cmd response: 0x0, card status: 0x0, card state: 0 (Card is in unknown state)
OS error code: 0x000003E3(The I/O operation has been aborted because of either a thread exit or an application request)
Operation aborted by user request.
Connection status: EHCI:HUB:HUB:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8841-0169
Boot version: 1.04, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... Done
VCCQ not properly connected
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 4MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: DH6DMB (0x444836444d42), rev: 0x05, serial number: 0xB8066A03
Manufacturing date: Oct 2017
CID: 15010044 4836444D 4205B806 6A03A46C
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 58.24 GiB(62,537,072,640 bytes)
Cache size: 64 MiB
Hardware reset function: 1
Partition configuration: 0x48
Boot acknowledge is sent during the boot operation
Boot partition 1 is enabled for boot
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x02
Bus width: x8 (sdr/ddr), boot mode: sdr(default), reset bus width to x1 sdr(default)
Boot area write protection: 0x00
Power-on write protection: possible
Permanent write protection: possible
Lock status: not locked
ANDROID System Info:
platform: MT6771, cpu abi: arm64-v8a
manufacturer: OPPO
board: oppo6771_17331, name: CPH1819
brand: OPPO, model: CPH1819 (OPPO F7)
build model list: CPH1811 (A73), CPH1837 (A73), CPH1839 (A73), CPH1835 (OPPO R15), CPH1819 (OPPO F7)
build id: PPR1.180610.011, version: 9 Pie (CPH1819EX_11_C.10)
build description: full_oppo6771_17331-user 9 PPR1.180610.011 eng.root.20191119.143355 release-keys
crypto state: encrypted?
Custom moviNAND command is not supported for this device(MMC51).
Detected: SAMSUNG moviNAND KMDH6000DM-BXXX/64G

OPPOCPH 1901 PATTERN AND FRP DONE

Connection status: EHCI:HUB:HUB:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8841-0169
Boot version: 1.04, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... Done
VCCQ not properly connected
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 4MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: RH64AB (0x524836344142), rev: 0x05, serial number: 0xA12E9B7F
Manufacturing date: Dec 2018
CID: 15010052 48363441 4205A12E 9B7FC5E6
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 58.24 GiB(62,537,072,640 bytes)
Cache size: 64 MiB
Hardware reset function: 1
Partition configuration: 0x38
No boot acknowledge is sent (default)
User area is enabled for boot
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x00
Boot area write protection: 0x00
Power-on write protection: possible
Permanent write protection: possible
Lock status: not locked
EXT_CSD backup saved to "\\%BACKUPS%\RH64AB_A12E9B7F.ext_csd"
ANDROID System Info:
platform: msm8953, cpu abi: arm64-v8a
manufacturer: OPPO
board: msm8953, name: CPH1901
brand: OPPO, model: CPH1901 (OPPO A7)
build model list: CPH1901 (OPPO A7)
build id: OPM1.171019.026, version: 9 Pie (CPH1901EX_11_A.10)
build description: msm8953_64-user 8.1.0 OPM1.171019.026 eng.root.20190823.123130 release-keys
crypto state: encrypted?
Custom moviNAND command is not supported for this device(MMC51).
Selected: [SAMSUNG] KMRH60014A-B614/64GB (BGA221)
Connection status: EHCI:HUB:HUB:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8841-0169
Boot version: 1.04, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... Done
VCCQ not properly connected
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 4MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: RH64AB (0x524836344142), rev: 0x05, serial number: 0xA12E9B7F
Manufacturing date: Dec 2018
CID: 15010052 48363441 4205A12E 9B7FC5E6
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 58.24 GiB(62,537,072,640 bytes)
MasterClear [1]... Done
Connection status: EHCI:HUB:HUB:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8841-0169
Boot version: 1.04, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... Done
VCCQ not properly connected
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 4MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: RH64AB (0x524836344142), rev: 0x05, serial number: 0xA12E9B7F
Manufacturing date: Dec 2018
CID: 15010052 48363441 4205A12E 9B7FC5E6
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 58.24 GiB(62,537,072,640 bytes)
MasterClear [5]... Done
Connection status: EHCI:HUB:HUB:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8841-0169
Boot version: 1.04, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... Done
VCCQ not properly connected
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 4MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: RH64AB (0x524836344142), rev: 0x05, serial number: 0xA12E9B7F
Manufacturing date: Dec 2018
CID: 15010052 48363441 4205A12E 9B7FC5E6
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 58.24 GiB(62,537,072,640 bytes)
Clear FRP Lock... Done
Connection status: EHCI:HUB:HUB:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8841-0169
Boot version: 1.04, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... Done
VCCQ not properly connected
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 4MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: RH64AB (0x524836344142), rev: 0x05, serial number: 0xA12E9B7F
Manufacturing date: Dec 2018
CID: 15010052 48363441 4205A12E 9B7FC5E6
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 58.24 GiB(62,537,072,640 bytes)
Cache size: 64 MiB
Hardware reset function: 1
Partition configuration: 0x38
No boot acknowledge is sent (default)
User area is enabled for boot
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x00
Boot area write protection: 0x00
Power-on write protection: possible
Permanent write protection: possible
Lock status: not locked
ANDROID System Info:
platform: msm8953, cpu abi: arm64-v8a
manufacturer: OPPO
board: msm8953, name: CPH1901
brand: OPPO, model: CPH1901 (OPPO A7)
build model list: CPH1901 (OPPO A7)
build id: OPM1.171019.026, version: 9 Pie (CPH1901EX_11_A.10)
build description: msm8953_64-user 8.1.0 OPM1.171019.026 eng.root.20190823.123130 release-keys
crypto state: encrypted?
Custom moviNAND command is not supported for this device(MMC51).
Selected: [SAMSUNG] KMRH60014A-B614/64GB (BGA221)

OPPO CPH 1923 PATTERN AND FRP DONE

Connection status: EHCI:HUB:HUB:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8841-0169
Boot version: 1.04, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... Done
VCCQ not properly connected
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 4MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: QD63MB (0x514436334d42), rev: 0x03, serial number: 0x9FB2076B
Manufacturing date: Sep 2019
CID: 15010051 4436334D 42039FB2 076B9686
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 16384 KiB
User area: 29.12 GiB(31,268,536,320 bytes)
Cache size: 64 MiB
Hardware reset function: 1
Partition configuration: 0x48
Boot acknowledge is sent during the boot operation
Boot partition 1 is enabled for boot
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x02
Bus width: x8 (sdr/ddr), boot mode: sdr(default), reset bus width to x1 sdr(default)
Boot area write protection: 0x00
Power-on write protection: possible
Permanent write protection: possible
Lock status: not locked
EXT_CSD backup saved to "\\%BACKUPS%\QD63MB_9FB2076B.ext_csd"
ANDROID System Info:
platform: MT6765, cpu abi: arm64-v8a
manufacturer: OPPO
board: oppo6762_18540, name: CPH1923
brand: OPPO, model: CPH1923 (OPPO A1k)
build model list: CPH1923 (OPPO A1k)
build id: PPR1.180610.011, version: 9 Pie (CPH1923EX_11_A.19)
build description: full_oppo6762_18540-user 9 PPR1.180610.011 eng.root.20190716.170229 release-keys
crypto state: encrypted?
crypto state: encrypted?
Custom moviNAND command is not supported for this device(MMC51).
Detected: SAMSUNG moviNAND KMQD60003M-BXXX/32G
Connection status: EHCI:HUB:HUB:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8841-0169
Boot version: 1.04, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... Done
VCCQ not properly connected
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 4MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: QD63MB (0x514436334d42), rev: 0x03, serial number: 0x9FB2076B
Manufacturing date: Sep 2019
CID: 15010051 4436334D 42039FB2 076B9686
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 16384 KiB
User area: 29.12 GiB(31,268,536,320 bytes)
[Oppo] MasterClear [1]... Done
Connection status: EHCI:HUB:HUB:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8841-0169
Boot version: 1.04, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... Done
VCCQ not properly connected
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 4MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: QD63MB (0x514436334d42), rev: 0x03, serial number: 0x9FB2076B
Manufacturing date: Sep 2019
CID: 15010051 4436334D 42039FB2 076B9686
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 16384 KiB
User area: 29.12 GiB(31,268,536,320 bytes)
[Oppo] MasterClear [5]... Done
Connection status: EHCI:HUB:HUB:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8841-0169
Boot version: 1.04, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... Done
VCCQ not properly connected
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 4MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: QD63MB (0x514436334d42), rev: 0x03, serial number: 0x9FB2076B
Manufacturing date: Sep 2019
CID: 15010051 4436334D 42039FB2 076B9686
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 16384 KiB
User area: 29.12 GiB(31,268,536,320 bytes)
Clear FRP Lock... Done
Connection status: EHCI:HUB:HUB:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8841-0169
Boot version: 1.04, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... Done
VCCQ not properly connected
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 4MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: QD63MB (0x514436334d42), rev: 0x03, serial number: 0x9FB2076B
Manufacturing date: Sep 2019
CID: 15010051 4436334D 42039FB2 076B9686
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 16384 KiB
User area: 29.12 GiB(31,268,536,320 bytes)
Cache size: 64 MiB
Hardware reset function: 1
Partition configuration: 0x48
Boot acknowledge is sent during the boot operation
Boot partition 1 is enabled for boot
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x02
Bus width: x8 (sdr/ddr), boot mode: sdr(default), reset bus width to x1 sdr(default)
Boot area write protection: 0x00
Power-on write protection: possible
Permanent write protection: possible
Lock status: not locked
ANDROID System Info:
platform: MT6765, cpu abi: arm64-v8a
manufacturer: OPPO
board: oppo6762_18540, name: CPH1923
brand: OPPO, model: CPH1923 (OPPO A1k)
build model list: CPH1923 (OPPO A1k)
build id: PPR1.180610.011, version: 9 Pie (CPH1923EX_11_A.19)
build description: full_oppo6762_18540-user 9 PPR1.180610.011 eng.root.20190716.170229 release-keys
crypto state: encrypted?
crypto state: encrypted?
Custom moviNAND command is not supported for this device(MMC51).
Detected: SAMSUNG moviNAND KMQD60003M-BXXX/32G
+++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++
CPH1819EX_11_C.10 file link
 
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