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Martview RB-03 - Universal BGA Reballing Platform

Post Success Reports Here Successfully Repaired/Dead Recovered Handset By Ufi Box

F

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Friend's Martview
Jan 31, 2017
3,186
6,457
Martview
XIAOMI REDMI NOTE 4 HANG ON LOGO SOLVED BY UFI BOX

READ INFO

FLASH

MI ACCOUNT REMOVE







​
 
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chlakh11787

Member
Jul 27, 2020
9
9
morocco
ferouzkassim said:
OPPO A7X CPH1903 PASSWORD REMOVE AND FRP DONE

Connection status: EHCI:HUB:HUB:USB 2.0 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8840-4224
Boot version: 1.04, FW version: 1.12 (Jun 7 2018 00:06:47)
Insertion test... Done.
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 4MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: GP6BMB (0x475036424d42), rev: 0x01, serial number: 0x958AA894
Manufacturing date: Sep 2018
CID: 15010047 5036424D 4201958A A89495CA
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 16384 KiB
User area: 58.24 GiB(62,537,072,640 bytes)
Cache size: 64 MiB
Hardware reset function: 1
Partition configuration: 0x38
No boot acknowledge is sent (default)
User area is enabled for boot
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x00
Boot area write protection: 0x00
Power-on write protection: possible
Permanent write protection: possible
Lock status: not locked
EXT_CSD backup saved to "\\%BACKUPS%\GP6BMB_958AA894.ext_csd"

ANDROID System Info:
platform: msm8953, cpu abi: arm64-v8a
manufacturer: OPPO
board: msm8953, name: CPH1903
brand: OPPO, model: CPH1903(OPPO AX7)
build id: OPM1.171019.026, version: 8.1.0 Oreo (CPH1903EX_11_A.09)
build description: msm8953_64-user 8.1.0 OPM1.171019.026 eng.root.20190225.181918 release-keys

crypto state: encrypted?
Custom moviNAND command is not supported for this device(MMC51).
Detected: SAMSUNG moviNAND KMGP6000BM-BXXX/64G


Connection status: EHCI:HUB:HUB:USB 2.0 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8840-4224
Boot version: 1.04, FW version: 1.12 (Jun 7 2018 00:06:47)
Insertion test... Done.
VCCQ not properly connected
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 4MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: GP6BMB (0x475036424d42), rev: 0x01, serial number: 0x958AA894
Manufacturing date: Sep 2018
CID: 15010047 5036424D 4201958A A89495CA
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 16384 KiB
User area: 58.24 GiB(62,537,072,640 bytes)

Factory Reset...
Creating filesystem... Done.
Writing cache... Done.
Creating filesystem... Done.
Writing userdata... Done.
Done.

Connection status: EHCI:HUB:HUB:USB 2.0 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8840-4224
Boot version: 1.04, FW version: 1.12 (Jun 7 2018 00:06:47)
Insertion test... Done.
VCCQ not properly connected
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 4MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: GP6BMB (0x475036424d42), rev: 0x01, serial number: 0x958AA894
Manufacturing date: Sep 2018
CID: 15010047 5036424D 4201958A A89495CA
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 16384 KiB
User area: 58.24 GiB(62,537,072,640 bytes)

Clear FRP Lock... Done.
Click to expand...



pls i need français this file for unbrick cph1903

Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 16384 KiB
User area: 58.24 GiB(62,537,072,640 bytes)
 
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mahmudhridoy

Junior Member
Apr 9, 2019
4
0
Please Help Me My UFI Box Update Nhi Ho Rahi
 

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ferouzkassim

ferouzkassim

Active Member
Oct 11, 2018
51
34
Uganda
Skype
ferouz_kassim
LG MS330 FAILED TO BOOT TO DOWNLOAD MODE (MODIFIED LAF FIXED)
Connection status: XHCI:HUB3:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8840-4224
Boot version: 1.04, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... Done
VCCQ not properly connected
Init bus...
VCC: 3.3 V, VCCQ: 3.0 V
Bus: 1 bit (SDR 52MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x90 (SK Hynix)
Product name: H8G1e (0x483847316505), rev: 0x08, serial number: 0x20B9B922
Manufacturing date: Jul 2016
CID: 90014A48 38473165 050820B9 B9227384
CSD: D0270132 0F5903FF FFFFFFEF 8A4040D2
EXT_CSD revision: 1.7 (MMC v5.0, v5.01)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 7.28 GiB(7,818,182,656 bytes)
Cache size: 1 MiB
Hardware reset function: 1
Partition configuration: 0x00
No boot acknowledge is sent (default)
Device is not boot-enabled (default)
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x00
Boot area write protection: 0x00
Power-on write protection: possible
Permanent write protection: possible
Lock status: not locked
User area write protection: 0x10
Password protection features: enabled
Power-on write protection: possible
Permanent write protection: not possible
Lock status: not locked

ANDROID System Info:
platform: msm8909, cpu abi: armeabi-v7a
manufacturer: LGE
board: msm8909, name: m1_mpcs_us
brand: MetroPCS, model: LGMS330
build model list: LGMS330
build id: LMY47V, version: 5.1.1 Lollipop (MS33010m)
build description: m1_mpcs_us-user 5.1.1 LMY47V 1730518539138 release-keys

Internal storage: 4.52 GiB
crypto state: unencrypted
Selected: [HYNIX] eNAND H9TQ64ABJTMCUR-KUM/8GB+LPDDR3 16Gb (BGA221)


JUST CONNECT ISP AND FLASH KDZ
 

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ferouzkassim

ferouzkassim

Active Member
Oct 11, 2018
51
34
Uganda
Skype
ferouz_kassim
oppo A31 CPH2015
PASSWORD REMOVE DONE

Connection status: XHCI:HUB3:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8840-4224
Boot version: 1.04, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... Done
VCCQ not properly connected
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 4MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: DH6DAB (0x444836444142), rev: 0x02, serial number: 0x85C46AE4
Manufacturing date: Mar 2020
CID: 15010044 48364441 420285C4 6AE43768
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 16384 KiB
User area: 58.24 GiB(62,537,072,640 bytes)
Cache size: 64 MiB
Hardware reset function: 1
Partition configuration: 0x48
Boot acknowledge is sent during the boot operation
Boot partition 1 is enabled for boot
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x02
Bus width: x8 (sdr/ddr), boot mode: sdr(default), reset bus width to x1 sdr(default)
Boot area write protection: 0x00
Power-on write protection: possible
Permanent write protection: possible
Lock status: not locked

ANDROID System Info:
platform: MT6765, cpu abi: arm64-v8a
manufacturer: OPPO
board: oppo6765_19581, name: CPH2015
brand: OPPO, model: CPH2015 (OPPO A31)
build model list: CPH2015 (OPPO A31)
build id: PPR1.180610.011, version: 9 Pie (CPH2015EX_11_A.37)
build description: full_oppo6765_19581-user 9 PPR1.180610.011 eng.root.20200716.095015 release-keys

crypto state: encrypted?
crypto state: encrypted?
EXT_CSD backup saved to "\\%BACKUPS%\DH6DAB_85C46AE4.ext_csd"
Custom moviNAND command is not supported for this device(MMC51).
Detected: SAMSUNG moviNAND KMDH6000DA-BXXX/64G






Connection status: XHCI:HUB3:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8840-4224
Boot version: 1.04, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... Done
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 4MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: DH6DAB (0x444836444142), rev: 0x02, serial number: 0x85C46AE4
Manufacturing date: Mar 2020
CID: 15010044 48364441 420285C4 6AE43768
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 16384 KiB
User area: 58.24 GiB(62,537,072,640 bytes)

MasterClear [1]... Done
 
R

Rak_1790

Junior Member
Jun 12, 2020
2
0
India
I can't flash any mi phone like mi 6a
Mi6 mtk cpu or Qualcomm cpu wich one how to use credit any time say upgrade your system memory low like that what is pro say any think my pc ram is 4gb
 
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