Post Success Reports Here Successfully Repaired/Dead Recovered Handset By Ufi Box

anbumani25

Junior Member
Dec 24, 2019
1
0
oppo r11s cph1719 flash done with ufi uni android tool



Firehose: prog_emmc_ufs_firehose_Sdm660_ddr.elf
sha1: 5871f9bf6167c8ecc5d1af0f029856d671fe3eb2, size: 584.63 KiB
QC_IMAGE_VERSION: BOOT.XF.1.4.c1-00005-S660LZB-1
IMAGE_VARIANT: Sdm660LA
OEM_IMAGE_VERSION: ubuntu-121-238
Sending firehose loader... Done.
Handshaking...
[VIP] Validated Image Programming is enabled.
Sending signed DigestTable [DigestsToSign_17015_persist_no_userdata_yes.bin.mbn]... Done.
Sending ping... Done.
Binary build date: May 9 2017 09:31:00
Chip serial num: 4294967295 (0xffffffff)
Sending configurations...
TargetName: MSM8996
MemoryName: eMMC
DateTime: May 9 2017 - 09:31:00
Version: 1
Firehose configured.

Reading phone info... Done.
Processing rawprogram0_MSM_17015.xml
Erasing userdata... Done.
Erasing PrimaryGPT... Done.
Erasing backupgpt... Done.
Backing up download flag... Done.
Writing oppostanvbk at 0x00A05000 (20480 sectors)... Done.
Writing xbl at 0x06000000 (5460 sectors)... Done.
Writing xblbak at 0x06380000 (5460 sectors)... Done.
Writing tz at 0x06700000 (3728 sectors)... Done.
Writing tzbak at 0x06B00000 (3728 sectors)... Done.
Writing rpm at 0x06F00000 (440 sectors)... Done.
Writing rpmbak at 0x06F80000 (440 sectors)... Done.
Writing hyp at 0x07000000 (520 sectors)... Done.
Writing hypbak at 0x07080000 (520 sectors)... Done.
Writing pmic at 0x07100000 (78 sectors)... Done.
Writing pmicbak at 0x07180000 (78 sectors)... Done.
Writing boot at 0x07800000 (29611 sectors)... Done.
Writing bootbak at 0x0B800000 (29611 sectors)... Done.
Writing recovery at 0x0F800000 (41691 sectors)... Done.
Writing keymaster at 0x13800000 (699 sectors)... Done.
Writing keymasterbak at 0x13900000 (699 sectors)... Done.
Writing cmnlib at 0x13A00000 (426 sectors)... Done.
Writing cmnlib64 at 0x13B00000 (528 sectors)... Done.
Writing cmnlibbak at 0x13C00000 (426 sectors)... Done.
Writing cmnlib64bak at 0x13D00000 (528 sectors)... Done.
Writing mdtpsecapp at 0x13E00000 (2108 sectors)... Done.
Writing mdtpsecappbak at 0x14200000 (2108 sectors)... Done.
Writing mdtp at 0x14600000 (34782 sectors)... Done.
Writing mdtpbak at 0x16600000 (34782 sectors)... Done.
Writing dsp at 0x18600000 (32768 sectors)... Done.
Writing dspbak at 0x19600000 (32768 sectors)... Done.
Writing abl at 0x1A600000 (216 sectors)... Done.
Writing ablbak at 0x1A700000 (216 sectors)... Done.
Erasing dip... Done.
Erasing devinfo... Done.
Writing apdp at 0x1A901000 (27 sectors)... Done.
Erasing msadp... Done.
Erasing dpo... Done.
Writing splash at 0x1A982000 (4589 sectors)... Done.
Erasing limits... Done.
Erasing toolsfv... Done.
Erasing logfs... Done.
Erasing ddr... Done.
Writing bluetooth at 0x1D904000 (920 sectors)... Done.
Writing bluetoothbak at 0x1DA04000 (920 sectors)... Done.
Erasing misc... Done.
Erasing keystore... Done.
Writing devcfg at 0x1E183000 (96 sectors)... Done.
Writing devcfgbak at 0x1E283000 (96 sectors)... Done.
Erasing frp... Done.
Erasing logdump... Done.
Erasing sti... Done.
Writing LOGO at 0x22603000 (31777 sectors)... Done.
Erasing reserve_exp2... Done.
Writing DRIVER at 0x23A03000 (46476 sectors)... Done.
Erasing vbmeta... Done.
Erasing vbmetabak... Done.
Writing modem at 0x26020000 (204259 sectors)... Done.
Writing cache at 0x2E800000 (12497 sectors)... Done.
Writing system at 0x3E800000 (9072817 sectors)... Done.
Writing storsec at 0x1CE800000 (97 sectors)... Done.
Writing userdata at 0x1CF000000 (3444737 sectors)... Done.
Writing PrimaryGPT at 0x00000000 (34 sectors)... Done.
Writing BackupGPT at NUM_DISK_SECTORS-33. (33 sectors)... Done.
Restoring download flag... Done.
Set bootable drive to 0... Done.
Applying DISK patch... Done.

Flashing completed in 4 mins 42.747 s
HI
I NEED WORKING FLASH FILE FOR CPH1719 PLEASE GIVE LINK FOR THIS FILE
 

ferouzkassim

Active Member
Oct 11, 2018
36
22
Uganda
Skype
ferouz_kassim
OPPPO F11 PRO PASSWORD REMOVE DONE


Connection status: EHCI:HUB:HUB:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8840-4224
Boot version: 1.04, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... Done
VCCQ not properly connected
Init bus...
VCC: 3.3 V, VCCQ: 3.0 V
Bus: 1 bit (SDR 48MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x90 (SK Hynix)
Product name: hDEaP3 (0x684445615033), rev: 0x03, serial number: 0x3B67B581
Manufacturing date: Mar 2019
CID: 90014A68 44456150 33033B67 B5813618
CSD: D0270032 8F5903FF FFFFFFEF 8E400042
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 16384 KiB
User area: 116.48 GiB(125,074,145,280 bytes)
Cache size: 2 MiB
Hardware reset function: 1
Partition configuration: 0x48
Boot acknowledge is sent during the boot operation
Boot partition 1 is enabled for boot
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x02
Bus width: x8 (sdr/ddr), boot mode: sdr(default), reset bus width to x1 sdr(default)
Boot area write protection: 0x00
Power-on write protection: possible
Permanent write protection: possible
Lock status: not locked
EXT_CSD backup saved to "\\%BACKUPS%\hDEaP3_3B67B581.ext_csd"

ANDROID System Info:
platform: MT6771, cpu abi: arm64-v8a
manufacturer: OPPO
board: oppo6771_18531, name: CPH1969
brand: OPPO, model: CPH1969 (OPPO F11 Pro)
build model list: CPH1985 (OPPO R15), CPH1987 (OPPO F11 Pro), CPH1969 (OPPO F11 Pro)
build id: PPR1.180610.011, version: 9 Pie (CPH1969EX_11_A.38)
build description: full_oppo6771_18531-user 9 PPR1.180610.011 eng.root.20191024.232120 release-keys

crypto state: encrypted?
crypto state: encrypted?


Connection status: EHCI:HUB:HUB:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8840-4224
Boot version: 1.04, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... Done
VCCQ not properly connected
Init bus...
VCC: 3.3 V, VCCQ: 3.0 V
Bus: 1 bit (SDR 48MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x90 (SK Hynix)
Product name: hDEaP3 (0x684445615033), rev: 0x03, serial number: 0x3B67B581
Manufacturing date: Mar 2019
CID: 90014A68 44456150 33033B67 B5813618
CSD: D0270032 8F5903FF FFFFFFEF 8E400042
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 16384 KiB
User area: 116.48 GiB(125,074,145,280 bytes)

[Oppo] MasterClear [2]... Done
 
Reactions: Ahmadaim1

Deepesh Sharma

Product Supporter
Apr 4, 2017
1,589
2,239
India
Sonork ID
100.1614172
Samsung A2Core (A260G) Dead Dropped Case Make DEad Port Exynos Only
Pasted Emmc Successfully Removed N Reprogramed And Set Recover Done By
Ufi-Box
Image Dead Port

Image-1

Ufi-log

Set Now Recovered Go To Download Mode

 

Deepesh Sharma

Product Supporter
Apr 4, 2017
1,589
2,239
India
Sonork ID
100.1614172
Realme C2 Rmx1941 Remove Userlock+Frp Lock Without Lost Any Media
All Job Successfully Done With Ufi-Box


Image

Remove Lock

Remove Frp

All Job Successfully Done
 

irfan111

Active Member
May 25, 2017
15
0
indai
Skype
irfan.same7
Sonork ID
100.1638194
Samsung J2 (j200G)Dead Recover Replace EmmcAnd Reprogram With Ufi-Box

Image 1(Make 1Jumper Under Emmc)

Ufi-log 1

Ufi-Log2

Successfully Alive Handset
bro idont have any backp after cange emme unknow basband
i tried all method write efs nv cert but reault same
 

mobilecarekgf

Member
Nov 24, 2019
8
1
OPPO F11 ( CPH1911 ) Dead Handset ( Other Shop Return ) Successfully By UFI BOX










Dr.Research-Center-Team

if it is cph1911 then in brand colom of ufi i see cph1803 why ?
mine still dead cph1911 set came with lock
did factory reset and got error and set dead
then write ext csd still dead please help
 

vkdsai

Junior Member
Mar 11, 2019
4
0
can u give me a260g isp pinout cause i cant remove emmc from bord
plz give me a favor plz
 

Hassani143143

Junior Member
Mar 27, 2017
2
0
Pakistan
oppo r15 chinese model password remove done(ufi emmc) with no risk

Connection status: EHCI:HUB:HUB:USB 2.0 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8840-4224
Boot version: 1.04, FW version: 1.12 (Jun 7 2018 00:06:47)
Insertion test... CLK not properly connected
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 4MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: 3V6CMB (0x335636434d42), rev: 0x02, serial number: 0xD31CC817
Manufacturing date: Mar 2018
CID: 15010033 5636434D 4202D31C C81735B8
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 16384 KiB
User area: 116.48 GiB(125,069,950,976 bytes)
Cache size: 64 MiB
Hardware reset function: 1
Partition configuration: 0x38
No boot acknowledge is sent (default)
User area is enabled for boot
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x00
Boot area write protection: 0x00
Power-on write protection: possible
Permanent write protection: possible
Lock status: not locked
EXT_CSD backup saved to "\\%BACKUPS%\3V6CMB_D31CC817.ext_csd"

ANDROID System Info:
platform: sdm660, cpu abi: arm64-v8a
manufacturer: OPPO
board: sdm660, name: PAAM00
brand: OPPO, model: OPPO PAAM00(OPPO R15 梦镜版)
build id: OPM1.171019.011, version: 8.1.0 Oreo (PAAM00_11_A.21_181205)
build description: sdm660_64-user 8.1.0 OPM1.171019.011 eng.root.20181205.154632 dev-keys

crypto state: encrypted?
Custom moviNAND command is not supported for this device(MMC51).
Detected: SAMSUNG moviNAND KM3V6000CM-BXXX/128G



Connection status: EHCI:HUB:HUB:USB 2.0 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8840-4224
Boot version: 1.04, FW version: 1.12 (Jun 7 2018 00:06:47)
Insertion test... CLK not properly connected
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 4MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: 3V6CMB (0x335636434d42), rev: 0x02, serial number: 0xD31CC817
Manufacturing date: Mar 2018
CID: 15010033 5636434D 4202D31C C81735B8
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 16384 KiB
User area: 116.48 GiB(125,069,950,976 bytes)

Factory Reset...
Creating filesystem... Done.
Writing cache... Done.
Creating filesystem... Done.
Writing userdata... Done.
Done.
Bro You Have oppo r15 Chinese model paam00 Dump file plz help me I need dump file
 

cellbhai

No Life Poster
Sep 26, 2018
300
88
OPPO F7,A7,A1K PATTERN AND FRP DONE
OPPO CPH 1819 PATTERN DONE

Connection status: EHCI:HUB:HUB:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8841-0169
Boot version: 1.04, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... Done
VCCQ not properly connected
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 4MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: DH6DMB (0x444836444d42), rev: 0x05, serial number: 0xB8066A03
Manufacturing date: Oct 2017
CID: 15010044 4836444D 4205B806 6A03A46C
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 58.24 GiB(62,537,072,640 bytes)
[Oppo] MasterClear [1]... Done
Connection status: EHCI:HUB:HUB:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8841-0169
Boot version: 1.04, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... Done
VCCQ not properly connected
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 4MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: DH6DMB (0x444836444d42), rev: 0x05, serial number: 0xB8066A03
Manufacturing date: Oct 2017
CID: 15010044 4836444D 4205B806 6A03A46C
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 58.24 GiB(62,537,072,640 bytes)
[Oppo] MasterClear [5]... Done
Connection status: EHCI:HUB:HUB:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8841-0169
Boot version: 1.04, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... Done
VCCQ not properly connected
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 4MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: DH6DMB (0x444836444d42), rev: 0x05, serial number: 0xB8066A03
Manufacturing date: Oct 2017
CID: 15010044 4836444D 4205B806 6A03A46C
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 58.24 GiB(62,537,072,640 bytes)
Clear FRP Lock... Done
Connection status: EHCI:HUB:HUB:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8841-0169
Boot version: 1.04, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... Done
VCCQ not properly connected
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 4MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: DH6DMB (0x444836444d42), rev: 0x05, serial number: 0xB8066A03
Manufacturing date: Oct 2017
CID: 15010044 4836444D 4205B806 6A03A46C
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 58.24 GiB(62,537,072,640 bytes)
Reading cache at 0x19A800000-0x1B57FFFFF size: 432 MiB... cmd response: 0x0, card status: 0x0, card state: 0 (Card is in unknown state)
OS error code: 0x000003E3(The I/O operation has been aborted because of either a thread exit or an application request)
Operation aborted by user request.
Connection status: EHCI:HUB:HUB:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8841-0169
Boot version: 1.04, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... Done
VCCQ not properly connected
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 4MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: DH6DMB (0x444836444d42), rev: 0x05, serial number: 0xB8066A03
Manufacturing date: Oct 2017
CID: 15010044 4836444D 4205B806 6A03A46C
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 58.24 GiB(62,537,072,640 bytes)
Cache size: 64 MiB
Hardware reset function: 1
Partition configuration: 0x48
Boot acknowledge is sent during the boot operation
Boot partition 1 is enabled for boot
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x02
Bus width: x8 (sdr/ddr), boot mode: sdr(default), reset bus width to x1 sdr(default)
Boot area write protection: 0x00
Power-on write protection: possible
Permanent write protection: possible
Lock status: not locked
ANDROID System Info:
platform: MT6771, cpu abi: arm64-v8a
manufacturer: OPPO
board: oppo6771_17331, name: CPH1819
brand: OPPO, model: CPH1819 (OPPO F7)
build model list: CPH1811 (A73), CPH1837 (A73), CPH1839 (A73), CPH1835 (OPPO R15), CPH1819 (OPPO F7)
build id: PPR1.180610.011, version: 9 Pie (CPH1819EX_11_C.10)
build description: full_oppo6771_17331-user 9 PPR1.180610.011 eng.root.20191119.143355 release-keys
crypto state: encrypted?
Custom moviNAND command is not supported for this device(MMC51).
Detected: SAMSUNG moviNAND KMDH6000DM-BXXX/64G

OPPOCPH 1901 PATTERN AND FRP DONE

Connection status: EHCI:HUB:HUB:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8841-0169
Boot version: 1.04, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... Done
VCCQ not properly connected
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 4MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: RH64AB (0x524836344142), rev: 0x05, serial number: 0xA12E9B7F
Manufacturing date: Dec 2018
CID: 15010052 48363441 4205A12E 9B7FC5E6
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 58.24 GiB(62,537,072,640 bytes)
Cache size: 64 MiB
Hardware reset function: 1
Partition configuration: 0x38
No boot acknowledge is sent (default)
User area is enabled for boot
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x00
Boot area write protection: 0x00
Power-on write protection: possible
Permanent write protection: possible
Lock status: not locked
EXT_CSD backup saved to "\\%BACKUPS%\RH64AB_A12E9B7F.ext_csd"
ANDROID System Info:
platform: msm8953, cpu abi: arm64-v8a
manufacturer: OPPO
board: msm8953, name: CPH1901
brand: OPPO, model: CPH1901 (OPPO A7)
build model list: CPH1901 (OPPO A7)
build id: OPM1.171019.026, version: 9 Pie (CPH1901EX_11_A.10)
build description: msm8953_64-user 8.1.0 OPM1.171019.026 eng.root.20190823.123130 release-keys
crypto state: encrypted?
Custom moviNAND command is not supported for this device(MMC51).
Selected: [SAMSUNG] KMRH60014A-B614/64GB (BGA221)
Connection status: EHCI:HUB:HUB:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8841-0169
Boot version: 1.04, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... Done
VCCQ not properly connected
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 4MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: RH64AB (0x524836344142), rev: 0x05, serial number: 0xA12E9B7F
Manufacturing date: Dec 2018
CID: 15010052 48363441 4205A12E 9B7FC5E6
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 58.24 GiB(62,537,072,640 bytes)
MasterClear [1]... Done
Connection status: EHCI:HUB:HUB:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8841-0169
Boot version: 1.04, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... Done
VCCQ not properly connected
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 4MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: RH64AB (0x524836344142), rev: 0x05, serial number: 0xA12E9B7F
Manufacturing date: Dec 2018
CID: 15010052 48363441 4205A12E 9B7FC5E6
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 58.24 GiB(62,537,072,640 bytes)
MasterClear [5]... Done
Connection status: EHCI:HUB:HUB:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8841-0169
Boot version: 1.04, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... Done
VCCQ not properly connected
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 4MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: RH64AB (0x524836344142), rev: 0x05, serial number: 0xA12E9B7F
Manufacturing date: Dec 2018
CID: 15010052 48363441 4205A12E 9B7FC5E6
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 58.24 GiB(62,537,072,640 bytes)
Clear FRP Lock... Done
Connection status: EHCI:HUB:HUB:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8841-0169
Boot version: 1.04, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... Done
VCCQ not properly connected
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 4MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: RH64AB (0x524836344142), rev: 0x05, serial number: 0xA12E9B7F
Manufacturing date: Dec 2018
CID: 15010052 48363441 4205A12E 9B7FC5E6
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 58.24 GiB(62,537,072,640 bytes)
Cache size: 64 MiB
Hardware reset function: 1
Partition configuration: 0x38
No boot acknowledge is sent (default)
User area is enabled for boot
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x00
Boot area write protection: 0x00
Power-on write protection: possible
Permanent write protection: possible
Lock status: not locked
ANDROID System Info:
platform: msm8953, cpu abi: arm64-v8a
manufacturer: OPPO
board: msm8953, name: CPH1901
brand: OPPO, model: CPH1901 (OPPO A7)
build model list: CPH1901 (OPPO A7)
build id: OPM1.171019.026, version: 9 Pie (CPH1901EX_11_A.10)
build description: msm8953_64-user 8.1.0 OPM1.171019.026 eng.root.20190823.123130 release-keys
crypto state: encrypted?
Custom moviNAND command is not supported for this device(MMC51).
Selected: [SAMSUNG] KMRH60014A-B614/64GB (BGA221)

OPPO CPH 1923 PATTERN AND FRP DONE

Connection status: EHCI:HUB:HUB:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8841-0169
Boot version: 1.04, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... Done
VCCQ not properly connected
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 4MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: QD63MB (0x514436334d42), rev: 0x03, serial number: 0x9FB2076B
Manufacturing date: Sep 2019
CID: 15010051 4436334D 42039FB2 076B9686
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 16384 KiB
User area: 29.12 GiB(31,268,536,320 bytes)
Cache size: 64 MiB
Hardware reset function: 1
Partition configuration: 0x48
Boot acknowledge is sent during the boot operation
Boot partition 1 is enabled for boot
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x02
Bus width: x8 (sdr/ddr), boot mode: sdr(default), reset bus width to x1 sdr(default)
Boot area write protection: 0x00
Power-on write protection: possible
Permanent write protection: possible
Lock status: not locked
EXT_CSD backup saved to "\\%BACKUPS%\QD63MB_9FB2076B.ext_csd"
ANDROID System Info:
platform: MT6765, cpu abi: arm64-v8a
manufacturer: OPPO
board: oppo6762_18540, name: CPH1923
brand: OPPO, model: CPH1923 (OPPO A1k)
build model list: CPH1923 (OPPO A1k)
build id: PPR1.180610.011, version: 9 Pie (CPH1923EX_11_A.19)
build description: full_oppo6762_18540-user 9 PPR1.180610.011 eng.root.20190716.170229 release-keys
crypto state: encrypted?
crypto state: encrypted?
Custom moviNAND command is not supported for this device(MMC51).
Detected: SAMSUNG moviNAND KMQD60003M-BXXX/32G
Connection status: EHCI:HUB:HUB:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8841-0169
Boot version: 1.04, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... Done
VCCQ not properly connected
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 4MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: QD63MB (0x514436334d42), rev: 0x03, serial number: 0x9FB2076B
Manufacturing date: Sep 2019
CID: 15010051 4436334D 42039FB2 076B9686
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 16384 KiB
User area: 29.12 GiB(31,268,536,320 bytes)
[Oppo] MasterClear [1]... Done
Connection status: EHCI:HUB:HUB:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8841-0169
Boot version: 1.04, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... Done
VCCQ not properly connected
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 4MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: QD63MB (0x514436334d42), rev: 0x03, serial number: 0x9FB2076B
Manufacturing date: Sep 2019
CID: 15010051 4436334D 42039FB2 076B9686
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 16384 KiB
User area: 29.12 GiB(31,268,536,320 bytes)
[Oppo] MasterClear [5]... Done
Connection status: EHCI:HUB:HUB:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8841-0169
Boot version: 1.04, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... Done
VCCQ not properly connected
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 4MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: QD63MB (0x514436334d42), rev: 0x03, serial number: 0x9FB2076B
Manufacturing date: Sep 2019
CID: 15010051 4436334D 42039FB2 076B9686
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 16384 KiB
User area: 29.12 GiB(31,268,536,320 bytes)
Clear FRP Lock... Done
Connection status: EHCI:HUB:HUB:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8841-0169
Boot version: 1.04, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... Done
VCCQ not properly connected
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 4MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: QD63MB (0x514436334d42), rev: 0x03, serial number: 0x9FB2076B
Manufacturing date: Sep 2019
CID: 15010051 4436334D 42039FB2 076B9686
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 16384 KiB
User area: 29.12 GiB(31,268,536,320 bytes)
Cache size: 64 MiB
Hardware reset function: 1
Partition configuration: 0x48
Boot acknowledge is sent during the boot operation
Boot partition 1 is enabled for boot
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x02
Bus width: x8 (sdr/ddr), boot mode: sdr(default), reset bus width to x1 sdr(default)
Boot area write protection: 0x00
Power-on write protection: possible
Permanent write protection: possible
Lock status: not locked
ANDROID System Info:
platform: MT6765, cpu abi: arm64-v8a
manufacturer: OPPO
board: oppo6762_18540, name: CPH1923
brand: OPPO, model: CPH1923 (OPPO A1k)
build model list: CPH1923 (OPPO A1k)
build id: PPR1.180610.011, version: 9 Pie (CPH1923EX_11_A.19)
build description: full_oppo6762_18540-user 9 PPR1.180610.011 eng.root.20190716.170229 release-keys
crypto state: encrypted?
crypto state: encrypted?
Custom moviNAND command is not supported for this device(MMC51).
Detected: SAMSUNG moviNAND KMQD60003M-BXXX/32G
+++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++