LG-X147 STUCK ON LOGO SOLVE BY UFI BOX
Post Success Reports Here Successfully Repaired/Dead Recovered Handset By Ufi Box
- Thread starter Deepesh Sharma
- Start date
Realme 2 Remove Userlock+Frp Without Lost Any Media All Offline job Done By -Ufi Box
Image
Remove User lock
Remove Frp Lock
Full Model Info.
All Lock Remove All Media Safe
Image
Remove User lock
Remove Frp Lock
Full Model Info.
All Lock Remove All Media Safe
aftab_ansari5287
Super Moderator
Redmi 6A MI Account Unlock Done without Creadit
Method-Open Emmc Then Remove Mi Account
Powered by ufi box
Done
Method-Open Emmc Then Remove Mi Account
Powered by ufi box
Done
.::THE ROCK::.
Friend's Martview
VIVO Y95 1807 DEAD QFIL ERASE PARTITION SOLVED UFI FLASH ISP
Honor 7A(AUM-L20) Always Fastboot Mode During Frp Remove By Other Technician Flashing Failed
Emmc Successfully Repaired Set Alive Done By Ufi-Box
Image
Emmc Reprogram
Set Sucessfully Alive
Special Thank To My N Jerry'S Friend Mentor Kamal Singla N Dr. Sunil Singh For Help Me find Correct FW. Ver And For His Guide.
Emmc Successfully Repaired Set Alive Done By Ufi-Box
Image
Emmc Reprogram
Set Sucessfully Alive
Special Thank To My N Jerry'S Friend Mentor Kamal Singla N Dr. Sunil Singh For Help Me find Correct FW. Ver And For His Guide.
Infinix X624B dead due to bad emmc health recover [emoji1732]
ferouzkassim
Active Member
oppo a7x
chinese variant
PBCT00 (OPPO A7x), password remove done
Connection status: EHCI:HUB:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8840-4224
Boot version: 1.04, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... Done
VCCQ not properly connected
Init bus...
VCC: 3.3 V, VCCQ: 3.0 V
Bus: 1 bit (SDR 52MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x13 (Micron)
Product name: S0J9K9 (0x53304a394b39), rev: 0x10, serial number: 0x0556075C
Manufacturing date: Aug 2018
CID: 13014E53 304A394B 39100556 075C85C4
CSD: D05F0132 8F5913FF FFFFFFEF 964000A8
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 16384 KiB
User area: 116.48 GiB(125,074,145,280 bytes)
Cache size: 2 MiB
Hardware reset function: 1
Partition configuration: 0x48
Boot acknowledge is sent during the boot operation
Boot partition 1 is enabled for boot
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x02
Bus width: x8 (sdr/ddr), boot mode: sdr(default), reset bus width to x1 sdr(default)
Boot area write protection: 0x00
Power-on write protection: possible
Permanent write protection: possible
Lock status: not locked
EXT_CSD backup saved to "\\%BACKUPS%\S0J9K9_0556075C.ext_csd"
ANDROID System Info:
platform: MT6771, cpu abi: arm64-v8a
manufacturer: OPPO
board: oppo6771_18011, name: PBBM00
brand: OPPO, model: PBBM00 (OPPO A7x)
build model list: PBCM00 (OPPO A7x), PBCT00 (OPPO A7x), PBBM00 (OPPO A7x)
build id: PPR1.180610.011, version: 9 Pie (PBBM00_11_C.10)
build description: full_oppo6771_18011-user 9 PPR1.180610.011 eng.root.20191114.225659 release-keys
crypto state: encrypted?
Connection status: EHCI:HUB:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8840-4224
Boot version: 1.04, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... Done
VCCQ not properly connected
Init bus...
VCC: 3.3 V, VCCQ: 3.0 V
Bus: 1 bit (SDR 24MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x13 (Micron)
Product name: S0J9K9 (0x53304a394b39), rev: 0x10, serial number: 0x0556075C
Manufacturing date: Aug 2018
CID: 13014E53 304A394B 39100556 075C85C4
CSD: D05F0132 8F5913FF FFFFFFEF 964000A8
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 16384 KiB
User area: 116.48 GiB(125,074,145,280 bytes)
[Oppo] MasterClear [1]... Done
chinese variant
PBCT00 (OPPO A7x), password remove done
Connection status: EHCI:HUB:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8840-4224
Boot version: 1.04, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... Done
VCCQ not properly connected
Init bus...
VCC: 3.3 V, VCCQ: 3.0 V
Bus: 1 bit (SDR 52MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x13 (Micron)
Product name: S0J9K9 (0x53304a394b39), rev: 0x10, serial number: 0x0556075C
Manufacturing date: Aug 2018
CID: 13014E53 304A394B 39100556 075C85C4
CSD: D05F0132 8F5913FF FFFFFFEF 964000A8
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 16384 KiB
User area: 116.48 GiB(125,074,145,280 bytes)
Cache size: 2 MiB
Hardware reset function: 1
Partition configuration: 0x48
Boot acknowledge is sent during the boot operation
Boot partition 1 is enabled for boot
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x02
Bus width: x8 (sdr/ddr), boot mode: sdr(default), reset bus width to x1 sdr(default)
Boot area write protection: 0x00
Power-on write protection: possible
Permanent write protection: possible
Lock status: not locked
EXT_CSD backup saved to "\\%BACKUPS%\S0J9K9_0556075C.ext_csd"
ANDROID System Info:
platform: MT6771, cpu abi: arm64-v8a
manufacturer: OPPO
board: oppo6771_18011, name: PBBM00
brand: OPPO, model: PBBM00 (OPPO A7x)
build model list: PBCM00 (OPPO A7x), PBCT00 (OPPO A7x), PBBM00 (OPPO A7x)
build id: PPR1.180610.011, version: 9 Pie (PBBM00_11_C.10)
build description: full_oppo6771_18011-user 9 PPR1.180610.011 eng.root.20191114.225659 release-keys
crypto state: encrypted?
Connection status: EHCI:HUB:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8840-4224
Boot version: 1.04, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... Done
VCCQ not properly connected
Init bus...
VCC: 3.3 V, VCCQ: 3.0 V
Bus: 1 bit (SDR 24MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x13 (Micron)
Product name: S0J9K9 (0x53304a394b39), rev: 0x10, serial number: 0x0556075C
Manufacturing date: Aug 2018
CID: 13014E53 304A394B 39100556 075C85C4
CSD: D05F0132 8F5913FF FFFFFFEF 964000A8
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 16384 KiB
User area: 116.48 GiB(125,074,145,280 bytes)
[Oppo] MasterClear [1]... Done
ferouzkassim
Active Member
vivo v15 pro password remove done
Connection status: EHCI:HUB:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8840-4224
Boot version: 1.04, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... CLK not properly connected
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 4MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: 3V6CMB (0x335636434d42), rev: 0x02, serial number: 0x0E9D6A61
Manufacturing date: Apr 2019
CID: 15010033 5636434D 42020E9D 6A6146D2
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 16384 KiB
User area: 116.48 GiB(125,069,950,976 bytes)
Cache size: 64 MiB
Hardware reset function: 1
Partition configuration: 0x00
No boot acknowledge is sent (default)
Device is not boot-enabled (default)
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x00
Boot area write protection: 0x00
Power-on write protection: possible
Permanent write protection: possible
Lock status: not locked
EXT_CSD backup saved to "\\%BACKUPS%\3V6CMB_0E9D6A61.ext_csd"
ANDROID System Info:
platform: sm6150, cpu abi: arm64-v8a
manufacturer: vivo
board: sm6150, name: sm6150
brand: vivo, model: vivo 1818
build model list: vivo 1818
build id: PKQ1.190302.001, version: 9 Pie (PKQ1.190302.001 release-keys)
build description: sm6150-user 9 PKQ1.190302.001 compiler12161832 release-keys
crypto state: encrypted?
Custom moviNAND command is not supported for this device(MMC51).
Detected: SAMSUNG moviNAND KM3V6000CM-BXXX/128G
Connection status: EHCI:HUB:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8840-4224
Boot version: 1.04, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... Done
VCCQ not properly connected
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 4MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: 3V6CMB (0x335636434d42), rev: 0x02, serial number: 0x0E9D6A61
Manufacturing date: Apr 2019
CID: 15010033 5636434D 42020E9D 6A6146D2
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 16384 KiB
User area: 116.48 GiB(125,069,950,976 bytes)
MasterClear [2]... Done
Connection status: EHCI:HUB:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8840-4224
Boot version: 1.04, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... CLK not properly connected
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 4MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: 3V6CMB (0x335636434d42), rev: 0x02, serial number: 0x0E9D6A61
Manufacturing date: Apr 2019
CID: 15010033 5636434D 42020E9D 6A6146D2
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 16384 KiB
User area: 116.48 GiB(125,069,950,976 bytes)
Cache size: 64 MiB
Hardware reset function: 1
Partition configuration: 0x00
No boot acknowledge is sent (default)
Device is not boot-enabled (default)
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x00
Boot area write protection: 0x00
Power-on write protection: possible
Permanent write protection: possible
Lock status: not locked
EXT_CSD backup saved to "\\%BACKUPS%\3V6CMB_0E9D6A61.ext_csd"
ANDROID System Info:
platform: sm6150, cpu abi: arm64-v8a
manufacturer: vivo
board: sm6150, name: sm6150
brand: vivo, model: vivo 1818
build model list: vivo 1818
build id: PKQ1.190302.001, version: 9 Pie (PKQ1.190302.001 release-keys)
build description: sm6150-user 9 PKQ1.190302.001 compiler12161832 release-keys
crypto state: encrypted?
Custom moviNAND command is not supported for this device(MMC51).
Detected: SAMSUNG moviNAND KM3V6000CM-BXXX/128G
Connection status: EHCI:HUB:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8840-4224
Boot version: 1.04, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... Done
VCCQ not properly connected
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 4MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: 3V6CMB (0x335636434d42), rev: 0x02, serial number: 0x0E9D6A61
Manufacturing date: Apr 2019
CID: 15010033 5636434D 42020E9D 6A6146D2
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 16384 KiB
User area: 116.48 GiB(125,069,950,976 bytes)
MasterClear [2]... Done
Oppo A37F Dead Replace Fully Black Pasted Emmc Samsung To Samsung
Emmc Successfully Reprogram Handset Alive By Ufi-Box
Image
Emmc Reprogram
Emmc Info.
Handset Alive
Emmc Successfully Reprogram Handset Alive By Ufi-Box
Image
Emmc Reprogram
Emmc Info.
Handset Alive
xiaomi redmi 6a mi account frp reset without credit ufi box martview forum
Vivo y53 how to recover emmc?
Attachments
-
IMG_20200225_162229.jpg
Oppo-A37fw Frp Reset Done By UFI Box
READ INFO
FRP RESET
READ INFO
FRP RESET
ferouzkassim
Active Member
OPPO, model: PBBM00 (PBBM00) Realme c1 china version password reset done
Connection status: EHCI:HUB:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8840-4224
Boot version: 1.04, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... CLK not properly connected
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 4MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: GP6BMB (0x475036424d42), rev: 0x01, serial number: 0xB103D38A
Manufacturing date: Aug 2019
CID: 15010047 5036424D 4201B103 D38A86B6
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 16384 KiB
User area: 58.24 GiB(62,537,072,640 bytes)
Cache size: 64 MiB
Hardware reset function: 1
Partition configuration: 0x38
No boot acknowledge is sent (default)
User area is enabled for boot
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x00
Boot area write protection: 0x00
Power-on write protection: possible
Permanent write protection: possible
Lock status: not locked
EXT_CSD backup saved to "\\%BACKUPS%\GP6BMB_B103D38A.ext_csd"
ANDROID System Info:
platform: msm8953, cpu abi: arm64-v8a
manufacturer: OPPO
board: msm8953, name: PBBM00
brand: OPPO, model: PBBM00 (PBBM00)
build model list: PBBM00 (PBBM00)
build id: OPM1.171019.026, version: 8.1.0 Oreo (PBBM00_11_A.16)
build description: S88051AA1-user 8.1.0 OPM1.171019.026 eng.root.20190919.211818 release-keys
crypto state: encrypted?
Custom moviNAND command is not supported for this device(MMC51).
Detected: SAMSUNG moviNAND KMGP6000BM-BXXX/64G
Connection status: EHCI:HUB:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8840-4224
Boot version: 1.04, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... CLK not properly connected
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 4MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: GP6BMB (0x475036424d42), rev: 0x01, serial number: 0xB103D38A
Manufacturing date: Aug 2019
CID: 15010047 5036424D 4201B103 D38A86B6
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 16384 KiB
User area: 58.24 GiB(62,537,072,640 bytes)
MasterClear [2]... Done
Connection status: EHCI:HUB:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8840-4224
Boot version: 1.04, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... CLK not properly connected
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 4MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: GP6BMB (0x475036424d42), rev: 0x01, serial number: 0xB103D38A
Manufacturing date: Aug 2019
CID: 15010047 5036424D 4201B103 D38A86B6
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 16384 KiB
User area: 58.24 GiB(62,537,072,640 bytes)
Cache size: 64 MiB
Hardware reset function: 1
Partition configuration: 0x38
No boot acknowledge is sent (default)
User area is enabled for boot
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x00
Boot area write protection: 0x00
Power-on write protection: possible
Permanent write protection: possible
Lock status: not locked
EXT_CSD backup saved to "\\%BACKUPS%\GP6BMB_B103D38A.ext_csd"
ANDROID System Info:
platform: msm8953, cpu abi: arm64-v8a
manufacturer: OPPO
board: msm8953, name: PBBM00
brand: OPPO, model: PBBM00 (PBBM00)
build model list: PBBM00 (PBBM00)
build id: OPM1.171019.026, version: 8.1.0 Oreo (PBBM00_11_A.16)
build description: S88051AA1-user 8.1.0 OPM1.171019.026 eng.root.20190919.211818 release-keys
crypto state: encrypted?
Custom moviNAND command is not supported for this device(MMC51).
Detected: SAMSUNG moviNAND KMGP6000BM-BXXX/64G
Connection status: EHCI:HUB:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8840-4224
Boot version: 1.04, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... CLK not properly connected
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 4MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: GP6BMB (0x475036424d42), rev: 0x01, serial number: 0xB103D38A
Manufacturing date: Aug 2019
CID: 15010047 5036424D 4201B103 D38A86B6
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 16384 KiB
User area: 58.24 GiB(62,537,072,640 bytes)
MasterClear [2]... Done
ferouzkassim
Active Member
OPPO R15X PASSWORD REMOVE DONE
OPPO, model: PBCM10 (OPPO R15x)
CHINA MODEL
Connection status: EHCI:HUB:USB 2.00 High-Speed
Interface: UFI High-Speed
Wrong wiring may results in damaged BOX or BRICK your device !!!
Don't use long wire, long wire will result in bad connections !!!
Disconnect ISP adapter from the box before soldering !!!
Make sure to use "anti static" soldering iron !!!
When internal VCC,VCCQ power is used, please use the -
external power DC 5V to the box for best performance.
--------------------------------------------------------------------------------
[ Open ISP Pinout picture ]
Serial number: 0011-8840-4224
Boot version: 1.04, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... CLK not properly connected
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 4MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x90 (SK Hynix)
Product name: hC8aP (0x68433861503e), rev: 0x03, serial number: 0x1DE2E0D6
Manufacturing date: Nov 2018
CID: 90014A68 43386150 3E031DE2 E0D6B526
CSD: D0270032 8F5903FF FFFFFFEF 8E400042
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 16384 KiB
User area: 58.24 GiB(62,537,072,640 bytes)
Cache size: 2 MiB
Hardware reset function: 1
Partition configuration: 0x38
No boot acknowledge is sent (default)
User area is enabled for boot
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x00
Boot area write protection: 0x00
Power-on write protection: possible
Permanent write protection: possible
Lock status: not locked
EXT_CSD backup saved to "\\%BACKUPS%\hC8aP_1DE2E0D6.ext_csd"
ANDROID System Info:
platform: sdm660, cpu abi: arm64-v8a
manufacturer: OPPO
board: sdm660, name: PBCM10
brand: OPPO, model: PBCM10 (OPPO R15x)
build model list: PBCM10 (OPPO R15x)
build id: OPM1.171019.011, version: 8.1.0 Oreo (PBCM10_11_A.19)
build description: sdm660_64-user 8.1.0 OPM1.171019.011 eng.root.20191213.211831 release-keys
crypto state: encrypted?
OPPO, model: PBCM10 (OPPO R15x)
CHINA MODEL
Connection status: EHCI:HUB:USB 2.00 High-Speed
Interface: UFI High-Speed
Wrong wiring may results in damaged BOX or BRICK your device !!!
Don't use long wire, long wire will result in bad connections !!!
Disconnect ISP adapter from the box before soldering !!!
Make sure to use "anti static" soldering iron !!!
When internal VCC,VCCQ power is used, please use the -
external power DC 5V to the box for best performance.
--------------------------------------------------------------------------------
[ Open ISP Pinout picture ]
Serial number: 0011-8840-4224
Boot version: 1.04, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... CLK not properly connected
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 4MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x90 (SK Hynix)
Product name: hC8aP (0x68433861503e), rev: 0x03, serial number: 0x1DE2E0D6
Manufacturing date: Nov 2018
CID: 90014A68 43386150 3E031DE2 E0D6B526
CSD: D0270032 8F5903FF FFFFFFEF 8E400042
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 16384 KiB
User area: 58.24 GiB(62,537,072,640 bytes)
Cache size: 2 MiB
Hardware reset function: 1
Partition configuration: 0x38
No boot acknowledge is sent (default)
User area is enabled for boot
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x00
Boot area write protection: 0x00
Power-on write protection: possible
Permanent write protection: possible
Lock status: not locked
EXT_CSD backup saved to "\\%BACKUPS%\hC8aP_1DE2E0D6.ext_csd"
ANDROID System Info:
platform: sdm660, cpu abi: arm64-v8a
manufacturer: OPPO
board: sdm660, name: PBCM10
brand: OPPO, model: PBCM10 (OPPO R15x)
build model list: PBCM10 (OPPO R15x)
build id: OPM1.171019.011, version: 8.1.0 Oreo (PBCM10_11_A.19)
build description: sdm660_64-user 8.1.0 OPM1.171019.011 eng.root.20191213.211831 release-keys
crypto state: encrypted?
Brother ferouzkassim
Try to next time post image please .
Bcoz many user not understand (Log).
So try to image please.
Try to next time post image please .
Bcoz many user not understand (Log).
So try to image please.
sir i need dump fileLephone w2 Stuck on Andriod Logo Successfully Recovered +Read Dump Done
Image
Ufi-Log REprogram Emmc
Read Dump
Handset Successfully Recovered Done
